ISPLSI1032E70LTNI LATTICE [Lattice Semiconductor], ISPLSI1032E70LTNI Datasheet

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ISPLSI1032E70LTNI

Manufacturer Part Number
ISPLSI1032E70LTNI
Description
In-System Programmable High Density PLD
Manufacturer
LATTICE [Lattice Semiconductor]
Datasheet
• HIGH DENSITY PROGRAMMABLE LOGIC
• HIGH PERFORMANCE E
• IN-SYSTEM PROGRAMMABLE
• OFFERS THE EASE OF USE AND FAST SYSTEM
1032e_09
Copyright © 2006 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
Features
— 6000 PLD Gates
— 64 I/O Pins, Eight Dedicated Inputs
— 192 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
— Small Logic Block Size for Random Logic
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
— In-System Programmable (ISP™) 5V Only
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Prototyping
— Complete Programmable Device Can Combine Glue
— Enhanced Pin Locking Capability
— Four Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
— Lead-Free Package Options
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
Machines, Address Decoders, etc.
f
t
Market and Improved Product Quality
Logic and Structured Designs
Minimize Switching Noise
Interconnectivity
max = 125 MHz Maximum Operating Frequency
pd = 7.5 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
In-System Programmable High Density PLD
The ispLSI 1032E is a High Density Programmable Logic
Device containing 192 Registers, 64 Universal I/O pins,
eight Dedicated Input pins, four Dedicated Clock Input
pins and a Global Routing
provides complete interconnectivity between all of these
elements. The ispLSI 1032E device offers 5V non-vola-
tile in-system programmability of the logic, as well as the
interconnects to provide truly reconfigurable systems. A
functional superset of the ispLSI 1032 architecture, the
ispLSI 1032E device adds two new global output enable
pins.
The basic unit of logic on the ispLSI 1032E device is the
Generic Logic Block (GLB). The GLBs are labeled A0,
A1…D7 (see Figure 1). There are a total of 32 GLBs in the
ispLSI 1032E device. Each GLB has 18 inputs, a pro-
grammable AND/OR/Exclusive OR array, and four outputs
which can be configured to be either combinatorial or
registered. Inputs to the GLB come from the GRP and
dedicated inputs. All of the GLB outputs are brought back
into the GRP so that they can be connected to the inputs
of any GLB on the device.
Functional Block Diagram
Description
A1
A2
A3
A4
A5
A6
A7
A0
D7 D6 D5 D4 D3 D2 D1 D0
B0 B1 B2 B3 B4 B5 B6 B7
Global Routing Pool (GRP)
Output Routing Pool
Output Routing Pool
ispLSI
Logic
Array
D Q
D Q
D Q
D Q
Pool (GRP). The GRP
GLB
®
1032E
CLK
C7
C6
C5
C4
C3
C2
C1
C0
August 2006
0139A(A1)-isp

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ISPLSI1032E70LTNI Summary of contents

Page 1

Features • HIGH DENSITY PROGRAMMABLE LOGIC — 6000 PLD Gates — 64 I/O Pins, Eight Dedicated Inputs — 192 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. — Small Logic ...

Page 2

Functional Block Diagram Figure 1. ispLSI 1032E Functional Block Diagram RESET Generic Logic Blocks (GLBs) I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O ...

Page 3

Absolute Maximum Ratings Supply Voltage V ...................................-0.5 to +7.0V cc Input Voltage Applied ........................ -2 Off-State Output Voltage Applied ..... -2 Storage Temperature ................................ -65 to 150°C Case Temp. with Power Applied .............. -55 to 125°C ...

Page 4

Switching Test Conditions Input Pulse Levels Input Rise and Fall Time 10% to 90% Input Timing Reference Levels Output Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. Output Load Conditions (see Figure 2) TEST ...

Page 5

External Timing Parameters 4 TEST 2 # PARAMETER COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay, Worst Case Path pd2 Clock Frequency with Internal Feedback max (Int.) ...

Page 6

External Timing Parameters 4 TEST 2 # PARAMETER COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay, Worst Case Path pd2 Clock Frequency with Internal Feedback max (Int.) ...

Page 7

Internal Timing Parameters 2 PARAM. # Inputs t 22 I/O Register Bypass iobp t 23 I/O Latch Delay iolat t iosu 24 I/O Register Setup Time before Clock t 25 I/O Register Hold Time after Clock ioh t 26 I/O ...

Page 8

Internal Timing Parameters 2 PARAM. # DESCRIPTION Inputs t 22 I/O Register Bypass iobp t iolat 23 I/O Latch Delay t 24 I/O Register Setup Time before Clock iosu t 25 I/O Register Hold Time after Clock ioh t ioco ...

Page 9

Internal Timing Parameters PARAM. # Outputs t 49 Output Buffer Delay Output Buffer Delay, Slew Limited Adder sl t oen 51 I/O Cell OE to Output Enabled t 52 I/O Cell OE to Output Disabled odis t ...

Page 10

Internal Timing Parameters PARAM. # Outputs t 49 Output Buffer Delay Output Buffer Delay, Slew Limited Adder I/O Cell OE to Output Enabled oen t 52 I/O Cell OE to Output Disabled odis t ...

Page 11

Timing Model I/O Cell Ded. In #28 I/O Reg Bypass I/O Pin #22 (Input) Input GRP Loading Register Q D RST #29 #59 # Reset Distribution Y1,2,3 Y0 GOE 0 ...

Page 12

Maximum GRP Delay vs GLB Loads 6.0 5.0 4.0 3.0 2.0 1.0 Power Consumption Power consumption in the ispLSI 1032E device depends on two primary factors: the speed at which the device is operating, and the number of product terms ...

Page 13

Pin Description PLCC PIN NAME NUMBERS 26, 27, 28, 29, I I/O 3 30, 31, 32, 33, I I/O 7 35, 36, 37, I I/O 11 34, 38, 39, 40, 41, I ...

Page 14

Pin Configurations ispLSI 1032E 84-Pin PLCC Pinout Diagram VCC 21 ...

Page 15

Pin Configurations ispLSI 1032E 100-Pin TQFP Pinout Diagram ...

Page 16

Part Number Description ispLSI Device Family Device Number Speed f 125 = 125 MHz max f 100 = 100 MHz max MHz max MHz max MHz max ispLSI ...

Page 17

Ordering Information (Cont.) Lead-Free Packaging FAMILY fmax (MHz) tpd (ns) 125 125 100 ispLSI 100 84-PLCC lead-free package is MSL4. Refer to "Handling Moisture Sensitive Packages" document on www.latticesemi.com. FAMILY fmax (MHz) tpd (ns) 70 ...

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