ISP1130DL Philips Semiconductors, ISP1130DL Datasheet - Page 64

• Manufacturer Part Number: ISP1130DL
• Description: Universal Serial Bus compound hub with integrated keyboard controller
• Manufacturer: Philips Semiconductors

Philips Semiconductors
9397 750 06895
Objective specification
20.4 Package related soldering information
Table 93: Suitability of IC packages for wave, reflow and dipping soldering methods
[1]
[2]
[3]
[4]
[5]
[6]
Surface mount
Mounting
Through-hole
mount
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Package
DBS, DIP, HDIP, SDIP, SIL suitable
BGA, LFBGA, SQFP,
TFBGA
HBCC, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP,
SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Rev. 01 — 23 March 2000
[4]
, SO, SOJ
USB compound hub with keyboard controller
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
[2]
[3]
© Philips Electronics N.V. 2000. All rights reserved.
[4] [5]
[6]
Reflow
suitable
suitable
suitable
suitable
suitable
ISP1130
[1]
Dipping
suitable
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