TDE1897CFP ST Microelectronics, TDE1897CFP Datasheet
TDE1897CFP
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TDE1897CFP Summary of contents
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... An in- ternal Clamping Diode enables the fast demag- netization of inductive loads. Diagnostic for CPU feedback and extensive use of electrical protections make this device inher- ently indistructible and suitable for general pur- pose industrial applications. SO20 TDE1897CFP TDE1898CFP 1/12 ...
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TDE1897C - TDE1898C PIN CONNECTIONS (Top view) Minidip SIP9 ABSOLUTE MAXIMUM RATINGS (Minidip pin reference) Symbol V Supply Voltage (Pins – V Supply to Output Differential Voltage. See also Input ...
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ELECTRICAL CHARACTERISTICS (V Symbol Parameter V 3 Supply Voltage for Valid smin Diagnostics V 3 Supply Voltage (operative Quiescent Current out os V Undervoltage Threshold 1 sth1 V 3 Undervoltage Threshold ...
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TDE1897C - TDE1898C SOURCE DRAIN NDMOS DIODE Symbol Parameter V 2-3 Forward On Voltage fsd I 2-3 Forward Peak Current fp t 2-3 Reverse Recovery Time rr t 2-3 Forward Recovery Time fr THERMAL CHARACTERISTICS (*) Lim Junction Temp. Protect. ...
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APPLICATION INFORMATION DEMAGNETIZATION OF INDUCTIVE LOADS An internal zener diode, limiting the voltage across the Power MOS to between 45 and 55V (V ), provides safe and fast demagnetization of cl inductive loads without external clamping devices. The maximum energy ...
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TDE1897C - TDE1898C WORST CONDITION POWER DISSIPATION IN THE ON-STATE In IPS applications the maximum average power dissipation occurs when the device stays for a long time in the ON state. In such a situation the internal temperature depends on ...
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All electrical parameters of the device, con- cerning the calculation, are at maximum val- ues. - Thermal shutdown threshold is at minimum value heat sink nor air circulation ( thj-amb Therefore: ...
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TDE1897C - TDE1898C Figure 6: Max. Output Current vs. Ambient Temperature (Minidip Package 100 C/W) th j-amb (mA) 600 500 400 300 200 100 Figure 8: Max. Output Current vs. Ambient Temperature ...
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MINIDIP PACKAGE MECHANICAL DATA DIM Min. Typ. A 3.32 a1 0.51 B 1.15 b 0.356 b1 0.204 D E 7.95 e 2.54 e3 7. Max. Min. 0.020 1.65 0.045 0.55 0.014 0.304 ...
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TDE1897C - TDE1898C SIP9 PACKAGE MECHANICAL DATA DIM. MIN. TYP 2 0. 0. 14.5 e 2.54 e3 20. ...
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SO20 PACKAGE MECHANICAL DATA DIM. MIN. TYP 0 0. 1.27 e3 11.43 F 7 MAX. MIN. 2.65 0.2 0.004 2.45 0.49 0.014 ...
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TDE1897C - TDE1898C Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may ...