EVAL-ADF9010EBZ AD [Analog Devices], EVAL-ADF9010EBZ Datasheet - Page 24

• Manufacturer Part Number: EVAL-ADF9010EBZ
• Description: 900 MHz ISM Band Analog RF Front End
• Manufacturer: AD [Analog Devices]

ADF9010
LO AND Tx OUTPUT MATCHING
The LO and Tx output stages are each connected to the collectors
of an NPN differential pair driven by buffered outputs from the
VCO or mixer outputs, respectively.
The recommended matching for each of these circuits consists
of a 7.5 nH shunt inductor to V
in the case of the Tx output a 50:100 balun to combine the Tx
outputs. The Anaren BD0810J50100A00 is ideally suited to this
task.
PCB DESIGN GUIDELINES
The lands on the chip scale package (CP-48-1) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
DD
, a 100 pF series capacitor, and
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pad. This ensures that the solder joint size is maximized. The
bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.