EVAL-ADT7410EBZ AD [Analog Devices], EVAL-ADT7410EBZ Datasheet - Page 5

• Manufacturer Part Number: EVAL-ADT7410EBZ
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
V
SDA Voltage to GND
SCL Output Voltage to GND
A0 Input Voltage to GND
A1 Input Voltage to GND
CT and INT Output Voltage to GND
ESD Rating (Human Body Model)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, T
8-Lead SOIC-N (R-8)
Thermal Impedance
IR Reflow Soldering
1
2
3
Values relate to package being used on a standard 2-layer PCB. This gives a
worst-case θ
vs. ambient temperature (T
T
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted
components.
DD
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time from 25°C to Peak Temperature
A
Power Dissipation
θ
θ
Peak Temperature (RoHS-Compliant
= ambient temperature.
JA
JC
to GND
Package)
, Junction-to-Ambient (Still Air)
, Junction-to-Case
JA
and θ
JC
. See Figure 3 for a plot of maximum power dissipation
3
1
A
).
JMAX
Rating
−0.3 V to +7 V
−0.3 V to V
−0.3 V to V
−0.3 V to V
−0.3 V to V
−0.3 V to V
2.0 kV
−55°C to +150°C
−65°C to +160°C
150°C
W
121°C/W
56°C/W
220°C
260°C (0°C)
20 sec to 40 sec
3°C/sec maximum
−6°C/sec maximum
8 minutes maximum
MAX
= (T
JMAX
DD
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
− T
A
2
)/θ
Rev. 0 | Page 5 of 24
JA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Figure 3. SOIC_N Maximum Power Dissipation vs. Temperature
1.2
1.0
0.8
0.6
0.4
0.2
0
TEMPERATURE (°C)
MAX PD = 3.4mW AT 150°C
ADT7410