TE28F320-C3TD70 Intel Corporation, TE28F320-C3TD70 Datasheet

TE28F320-C3TD70

Manufacturer Part Number

TE28F320-C3TD70

Description

Manufacturer

Intel Corporation

Datasheet

1.TE28F160C3BD90.pdf (72 pages)

Specifications of TE28F320-C3TD70

Case

TSOP/48

Date_code

04+

Current page: 1 of 72
Download datasheet (2Mb)

Intel® Advanced+ Boot Block Flash

Memory (C3)

28F800C3, 28F160C3, 28F320C3 (x16)

Product Features

The Intel

0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power

applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)

with high-speed, low-power operation. Flexible block locking allows any block to be

independently locked or unlocked. Add to this the Intel

software and you have a cost-effective, flexible, monolithic code plus data storage solution.

Intel

ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be

obtained from the Intel

Flexible SmartVoltage Technology

1.65 V to 2.5 V or 2.7 V to 3.6 V I/O

Option

High Performance

Optimized Architecture for Code Plus

Data Storage

Flexible Block Locking

Low Power Consumption

Extended Temperature Operation

— 2.7 V– 3.6 V read/program/erase

— 12 V for fast production programming

— Reduces overall system power

— 2.7 V– 3.6 V: 70 ns max access time

— Eight 4 Kword blocks, top or bottom

— Up to 127 x 32 Kword blocks

— Fast program suspend capability

— Fast erase suspend capability

— Lock/unlock any block

— Full protection on power-up

— Write Protect (WP#) pin for hardware

— 9 mA typical read

— 7 uA typical standby with Automatic

— -40 °C to +85 °C

parameter boot

block protection

Power Savings feature

Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-

Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest

Flash website: http://www.intel.com/design/flash.

128-bit Protection Register

Extended Cycling Capability

Software

Standard Surface Mount Packaging

ETOX™ VIII (0.13 µm) Flash

Technology

ETOX™ VII (0.18 µm) Flash Technology

ETOX™ VI (0.25 µm) Flash Technology

—64 bit unique device identifier

—64 bit user programmable OTP cells

—Minimum 100,000 block erase cycles

—Supported by Intel’s Advanced Flash

—Code and data storage in the same

—Robust Power Loss Recovery for Data

—Common Flash Interface

—http://www.intel.com/go/flashsw

—48-Ball µBGA*/VFBGA

—64-Ball Easy BGA packages

—48-TSOP package

—8, 16, 32 Mbit

—16, 32 Mbit

—8, 16 and 32 Mbit

File Managers -- Intel

FDI, etc.

memory device

Loss Prevention

Flash Data Integrator (Intel

Order Number: 290645, Revision: 023

VFM, Intel

Datasheet

FDI)

May 2005

Related parts for TE28F320-C3TD70

Related keywords

TE28F320-C3TD70 datasheet
TE28F320-C3TD70 data sheet
TE28F320-C3TD70 pdf datasheet
TE28F320-C3TD70 component
TE28F320-C3TD70 part
TE28F320-C3TD70 distributor
TE28F320-C3TD70 RoHS
TE28F320-C3TD70 datasheet download