MT9VDDT6472AG-335 Micron Semiconductor Products, MT9VDDT6472AG-335 Datasheet

MT9VDDT6472AG-335

Manufacturer Part Number

MT9VDDT6472AG-335

Description

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT9VDDT1672AG-265.pdf (13 pages)

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DDR SDRAM UDIMM

MT9VDDT1672A – 128MB

MT9VDDT3272A – 256MB

MT9VDDT6472A – 512MB

For component data sheets, refer to Micron’s Web site:

Features

• 184-pin, unbuffered dual in-line memory module

• Fast data transfer rates: PC2100, PC2700, or PC3200

• 128MB (16 Meg x 72), 256MB (32 Meg x 72), and

• Supports ECC error detection and correction

• V

• 2.5V I/O (SSTL_2-compatible)

• Internal, pipelined double data rate (DDR)

• Bidirectional data strobe (DQS) transmitted/

• Differential clock inputs (CK and CK#)

• Multiple internal device banks for concurrent

• Single rank

• Selectable burst lengths (BL): 2, 4, or 8

• Auto precharge option

• Auto refresh and self refresh modes: 128MB,

• Serial presence-detect (SPD) with EEPROM

• Selectable CAS latency (CL) for maximum

• Gold edge contacts

Table 1:

PDF: 09005aef808f912d/Source: 09005aef808f8ccd

DD9C16_32_64x72A.fm - Rev. E 11/07 EN

(UDIMM)

512MB (64 Meg x 72)

architecture; 2n-prefetch architecture

received with data—that is, source-synchronous

data capture

operation

15.625µs; 256MB and 512MB, 7.8125µs maximum

average periodic refresh interval

compatibility

DDSPD

Speed

Grade

-26A

-40B

-335

-262

-265

= V

= +2.3V to +3.6V

Q = +2.5V (-40B: V

Key Timing Parameters

Products and specifications discussed herein are subject to change by Micron without notice.

Nomenclature

Notes:

Industry

PC2700

PC2100

PC3200

1. The values of

128MB, 256MB, 512MB (x72, ECC, SR): 184-Pin DDR SDRAM UDIMM

actual DDR SDRAM device specifications are 15ns.

= V

CL = 3

400

–

RCD and

Data Rate (MT/s)

CL = 2.5

www.micron.com

RP for -335 modules show 18ns to align with industry specifications;

333

266

Figure 1:

Notes: 1. End of life.

PCB height: 31.75mm (1.25in)

Options

• Operating temperature

• Package

• Memory clock, speed, CAS latency

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

– 184-pin DIMM (standard)

– 184-pin DIMM (Pb-free)

– 5.0ns (200 MHz), 400 MT/s, CL = 3

– 6.0ns (167 MHz), 333 MT/s, CL = 2.5

– 7.5ns (133 MHz), 266 MT/s, CL = 2

– 7.5ns (133 MHz), 266 MT/s, CL = 2.5

CL = 2

266

200

Micron Technology, Inc., reserves the right to change products or specifications without notice.

2. Contact Micron for industrial temperature

3. Not recommended for new designs.

module offerings.

184-Pin UDIMM (MO-206)

(ns)

RCD

(ns)

≤ +85°C)

≤ +70°C)

(ns)

Marking

Features

None

-40B

-262

-26A

-265

-335

Notes

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