74LVC1G157GW,125 NXP Semiconductors, 74LVC1G157GW,125 Datasheet
74LVC1G157GW,125
Specifications of 74LVC1G157GW,125
935278315125
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74LVC1G157GW,125 Summary of contents
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Single 2-input multiplexer Rev. 4 — 28 October 2010 1. General description The 74LVC1G157 is a single 2-input multiplexer which select data from two data inputs (I0 and I1) under control of a common data select input (S). The ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range −40 °C to +125 °C 74LVC1G157GW −40 °C to +125 °C 74LVC1G157GV −40 °C to +125 °C 74LVC1G157GM −40 °C to +125 °C 74LVC1G157GF −40 °C to +125 °C 74LVC1G157GN −40 °C to +125 °C 74LVC1G157GS 4 ...
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... NXP Semiconductors Fig 3. Functional diagram Fig 4. Logic diagram 6. Pinning information 6.1 Pinning 74LVC1G157 GND 001aac656 Fig 5. Pin configuration SOT363 and SOT457 74LVC1G157 Product data sheet 1 I1 MULTIPLEXER SELECTOR 3 OUTPUT 74LVC1G157 GND 001aac657 Transparent top view Fig 6. Pin configuration SOT886 All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin I1 1 GND Functional description [1] Table 4. Function table Inputs [ HIGH voltage level LOW voltage level don’t care. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb Δt/ΔV input transition rise and fall rate V 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I power-off OFF CC leakage current I supply current GND 1. 5 ΔI additional per pin supply current input capacitance [1] All typical values are measured at T 11. Dynamic characteristics Table 8 ...
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... NXP Semiconductors 12. Waveforms I0, I1, S input Y output Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 8. Data inputs (I0, I1) and common data select input (S) to output (Y) propagation delays Table 9. Measurement points Supply voltage ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance; should be equal to the output impedance External voltage for measuring switching times. EXT Fig 9. Test circuit for measuring switching times Table 10. ...
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... NXP Semiconductors 13. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 10. Package outline SOT363 (SC-88) 74LVC1G157 Product data sheet scale 2.2 1.35 2 ...
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... NXP Semiconductors Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) UNIT 0.1 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT457 Fig 11. Package outline SOT457 (SC-74) 74LVC1G157 Product data sheet scale 3.1 1.7 3 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 13 ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date 74LVC1G157 v.4 20101028 • Modifications: Added type number 74LVC1G157GN (SOT1115 / XSON6 package). • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVC1G157 Product data sheet 16 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline ...