74HC237N,652 NXP Semiconductors, 74HC237N,652 Datasheet
74HC237N,652
Specifications of 74HC237N,652
74HC237N
933757180652
Related parts for 74HC237N,652
74HC237N,652 Summary of contents
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Rev. 4 — 10 January 2011 1. General description The 74HC237 is a high-speed Si-gate CMOS device and is pin compatible with low power Schottky TTL (LSTTL). The 74HC237 is specified in ...
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... NXP Semiconductors 4. Functional diagram Fig 1. Functional diagram INPUT A1 LATCHES Fig 2. Logic symbol 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches INPUT LATCHES DECODER DECODER 001aab869 Fig 3. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 4 — 10 January 2011 ...
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... NXP Semiconductors Fig 4. Logic diagram 5. Pinning information 5.1 Pinning 74HC237 GND 001aab868 Fig 5. Pin configuration DIP16 and SO16 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches A0 LATCH LATCH LATCH Fig 6. All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin 15, 14, 13, 12, 11, 10 output GND Functional description Table 3: Function table Enable Input [ HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors derates linearly with 12 mW/K above 70 C. [1] For DIP16 package: P tot derates linearly with 8 mW/K above 70 C. [2] For SO16 package: P tot derates linearly with 5.5 mW/K above 60 C. For SSOP16 package: P tot 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I input leakage current supply current 6 input I capacitance 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions t propagation An to Yn; see ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions t pulse width LE HIGH; see set-up time An to LE; see hold time An to LE; see power pF MHz dissipation V = GND capacitance [ the same as t and PLH PHL [ the same as t and t ...
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... NXP Semiconductors Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 8. Propagation enable inputs (E1) to output (Yn) and output transition time Measurement points are given in V and V are typical voltage output levels that occur with the output load. ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 10. Test circuit for measuring switching times Table 9. Test data Type Input V I 74HC237 ...
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... NXP Semiconductors 12. Application information strobe decoder enable input 0 address 237 outputs Fig 11. 6-to-64 line decoder with input address storage 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches 237 237 outputs All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 14. Package outline SOT338-1 (SSOP16) ...
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... Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Corrected the application drawing. Product data sheet ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74HC237 Product data sheet 3-to-8 line decoder, demultiplexer with address latches 16 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Application information Package outline ...