GS-BT2416C1H STMICROELECTRONICS [STMicroelectronics], GS-BT2416C1H Datasheet - Page 14

• Manufacturer Part Number: GS-BT2416C1H
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Soldering
9
14/19
Soldering
Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 8.
Figure 9.
Average ramp up rate (T
Temperature min (T
Temperature max (T
Time (t
Temperature T
Time t
Peak temperature (T
Time within 5 °C of actual peak temperature (t
Ramp down rate
Time from 25 °C to peak temperature
L
S
min to t
Time maintained above:
Soldering
Soldering
L
S
Profile feature
max) (t
Preheat
S
S
min)
p
max)
)
SMAX
S
)
to T
P
)
P
)
PB free assembly
3 °C / sec max
8 minutes max
60 – 100 sec
40 – 70 sec
10 – 20 sec
240 + 0 °C
6 °C / sec
150 °C
200 °C
217 °C
GS-BT2416C1.H