MPXAZ6115A MOTOROLA [Motorola, Inc], MPXAZ6115A Datasheet - Page 5

• Manufacturer Part Number: MPXAZ6115A
• Description: Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor
• Manufacturer: MOTOROLA [Motorola, Inc]

design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
Motorola Sensor Device Data
Surface mount board layout is a critical portion of the total
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
0.060 TYP 8X
1.52
Freescale Semiconductor, Inc.
For More Information On This Product,
Figure 6. SSOP Footprint (Case 1317 and 1317A)
Figure 5. SOP Footprint (Case 482 and 482A)
0.150
3.81
SURFACE MOUNTING INFORMATION
Go to: www.freescale.com
0.050
1.27
TYP
0.100 TYP 8X
2.54
0.660
16.76
0.053 TYP 8X
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
1.35
0.027 TYP 8X
0.69
0.387
9.83
inch
mm
inch
mm
0.100 TYP
MPXAZ6115A MPXHZ6115A SERIES
2.54
0.300
7.62
MPXAZ6115A
5