CBT3251DB,118 NXP Semiconductors, CBT3251DB,118 Datasheet

Page 1

CBT3251 1-of-8 FET multiplexer/demultiplexer Rev. 01 — 21 December 2005 1. General description The CBT3251 is a 1-of-8 high-speed TTL-compatible FET multiplexer/demultiplexer. The low ON-resistance of the switch allows inputs to be connected to outputs without adding propagation delay or ...

Page 2

Philips Semiconductors 4. Functional diagram Fig 1. Logic diagram of CBT3251 (positive logic) CBT3251_1 Product data sheet CBT3251 Rev. 01 — 21 December 2005 CBT3251 1-of-8 FET multiplexer/demultiplexer 4 B1 ...

Page 3

Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for SO16 n.c. OE GND Fig 4. Pin configuration for SSOP16 5.2 Pin description Table 2: Symbol B1, B2, B3, B4, B5, B6, B7 n.c. OE GND ...

Page 4

Philips Semiconductors 6. Functional description Refer to 6.1 Function selection Table HIGH state LOW state Don’t Care. Inputs Limiting values Table 4: ...

Page 5

Philips Semiconductors 9. Static characteristics Table 6: Static characteristics +85 C. amb Symbol Parameter V input clamping voltage IK V pass voltage pass I input leakage current LI I quiescent supply current CC I additional ...

Page 6

Philips Semiconductors 10.1 AC waveforms V = GND to 3 and t PLZ t and t PZL t and t PLH Fig 6. Input to output propagation delay (1) Waveform 1 is for an output with internal ...

Page 7

Philips Semiconductors 11. Test information Fig 8. Test circuit Table 8: Test PLZ PZL PHZ PZH CBT3251_1 Product data sheet from output under test Test data are given in Table 8. All ...

Page 8

Philips Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 9

Philips Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1.80 mm ...

Page 10

Philips Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.25 1.55 ...

Page 11

Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...

Page 12

Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 13

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 14

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 15

Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 16

Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...