CBT3251DB,118 NXP Semiconductors, CBT3251DB,118 Datasheet - Page 14

• Manufacturer Part Number: CBT3251DB,118
• Description: IC 1-OF-8 FET MUX/DEMUX 16-SSOP
• Manufacturer: NXP Semiconductors
• Series: 74CBTr
• Type: FET Multiplexer/Demuxr

Specifications of CBT3251DB,118

• Circuit: 1 x 1:8
• Independent Circuits: 1
• Current - Output High, Low: 15mA, 64mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Logic Family: CBT
• Number Of Bits: 8
• Number Of Elements: 1
• Technology: CMOS
• On Resistance: 14Ohm
• Propagation Delay Time: 6.4ns
• Package Type: SSOP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Quiescent Current: 3uA
• Pin Count: 16
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935274114118; CBT3251DB-T; CBT3251DB-T

Philips Semiconductors
14. Abbreviations
15. Revision history
Table 11:
CBT3251_1
Product data sheet
Document ID
CBT3251_1
Revision history
Release date
20051221
[4]
[5]
[6]
[7]
[8]
[9]
Table 10:
Acronym
CDM
ESD
FET
HBM
MM
PRR
TTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
Charged Device Model
ElectroStatic Discharge
Field-Effect Transistor
Human Body Model
Machine Model
Pulse Repetition Rate
Transistor-Transistor Logic
Rev. 01 — 21 December 2005
Change notice
-
1-of-8 FET multiplexer/demultiplexer
Doc. number
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Supersedes
-
CBT3251
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