K9F1G08D0M SAMSUNG [Samsung semiconductor], K9F1G08D0M Datasheet - Page 5

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K9F1G08D0M

Manufacturer Part Number
K9F1G08D0M
Description
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
K9F1G08Q0M
K9F1G08D0M
K9F1G08U0M K9F1G16U0M
PIN CONFIGURATION (WSOP1)
PACKAGE DIMENSIONS
48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - WSOP1 - 1217F
#24
#1
K9F1G16Q0M
K9F1G16D0M
DNU
DNU
DNU
DNU
CLE
ALE
N.C
N.C
N.C
N.C
N.C
R/B
N.C
Vcc
Vss
N.C
N.C
N.C
N.C
N.C
WE
WP
RE
CE
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
K9F1G08U0M-VCB0,FCB0/VIB0,FIB0
17.00
15.40
0.20
0.10
5
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
#48
#25
N.C
N.C
DNU
N.C
I/O7
I/O6
I/O5
I/O4
N.C
DNU
N.C
Vcc
Vss
N.C
DNU
N.C
I/O3
I/O2
I/O1
I/O0
N.C
DNU
N.C
N.C
FLASH MEMORY
0.70 MAX
0.58
0.04
(0.01Min)
0.45~0.75
Unit :mm

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