SE1050W SIGE [SiGe Semiconductor, Inc.], SE1050W Datasheet - Page 6

• Manufacturer Part Number: SE1050W
• Manufacturer: SIGE [SiGe Semiconductor, Inc.]

Bondpad Configuration
The bondpad center coordinates are referenced to the center of the lower left pad (pad 4). All dimensions are in
microns (µm).
45-DST-01 § Rev 1.5 § May 24/02
Pad No.
10
11
12
13
1
2
3
4
5
6
7
8
9
ACGND
Name
TZ_IN
OUTN
OUTP
VCC1
VCC1
VCC2
VCC2
GND
GND
GND
GND
GND
LightCharger
Coordinate
234.9
121.7
116.5
233.5
365.2
480.2
693.0
808.0
808.0
808.0
619.9
(µm)
X
0
0
™
10 Gb/s Transimpedance Amplifier
Coordinate
658.0
658.0
510.3
418.9
537.3
658.0
(µm)
Y
0
0
0
0
0
0
0
SE1050W
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Final