ISL8023AIRTAJZ-T7A Intersil, ISL8023AIRTAJZ-T7A Datasheet - Page 19

• Manufacturer Part Number: ISL8023AIRTAJZ-T7A
• Description: ISL8023 Series 2.7 - 5.5 V 3 A 4 Mhz Buck Regulator - TQFN-16
• Manufacturer: Intersil

PCB Layout Recommendation
The PCB layout is a very important converter design step to make
sure the designed converter works well. For ISL8023, ISL8024,
the power loop is composed of the output inductor L’s, the output
capacitor C
necessary to make the power loop as small as possible and the
connecting traces among them should be direct, short and wide.
The switching node of the converter, the PHASE pins, and the
traces connected to the node are very noisy, so keep the voltage
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
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December 22, 2011
February 15, 2012
February 1, 2012
May 7, 2012
DATE
OUT
ISL8023, ISL8024
, the PHASE’s pins, and the PGND pin. It is
FN7812.2
FN7812.1
FN7812.0
REVISION
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
19
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Page 2: Updated with new silkscreen to show the correct placement of U1-Pin1.
Page 3: Pin Descriptions , COMP, FB Changed the description from "Must connect COMP to SGND in internal
compensation mode " to "Recommend connect COMP to SGND in internal compensation mode".
Updated Figure 3 to show the COMP pin tied to GND
Page 18: Put compensator zero ωcz2 = (5to8) R0C0" changed to "..... R2C3"
Figure 44, Simulated Loop Gain: Added Y-axis title to the top graph: GAIN (VLOOP(S(fi)))
In the “Absolute Maximum Ratings” on page 6, changed “VIN” from “-0.3V” to “-0.3V to 6.5V (DC) or 7V (20ms)"
Revised description, Features and Applications on page 1. Added Figure 2.
Initial Release.
in the quality certifications found at
http://rel.intersil.com/reports/search.php
For additional products, see
ISL8023, ISL8024
www.intersil.com/askourstaff
www.intersil.com/product_tree
www.intersil.com/design/quality
feedback trace away from these noisy traces. The input capacitor
should be placed as close as possible to the VIN pin . The ground
of input and output capacitors should be connected as closely as
possible. The heat of the IC is mainly dissipated through the
thermal pad. Maximizing the copper area connected to the
thermal pad is preferable. In addition, a solid ground plane is
helpful for better EMI performance. It is recommended to add at
least 5 vias ground connection within the pad for the best
thermal relief.
CHANGE
www.intersil.com
www.intersil.com/products
May 17, 2012
FN7812.2
for a