CY8CMBR2016-24LQXI Cypress Semiconductor, CY8CMBR2016-24LQXI Datasheet - Page 17

• Manufacturer Part Number: CY8CMBR2016-24LQXI
• Description: Touch Screen Converters & Controllers
• Manufacturer: Cypress Semiconductor
• Type: Capacitive Touch Controllersr

Specifications of CY8CMBR2016-24LQXI

• Rohs: yes
• Input Type: 16 Key
• Supply Voltage: 1.71 V to 5.5 V
• Supply Current: 3.3 mA
• Operating Temperature: - 40 C to + 85 C
• Package / Case: QFN-48
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 490
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.71 V

Table 7. Layout Guidelines (continued)
X: Button to ground clearance (Refer to
Document Number: 001-67921 Rev. *C
13.
14.
15.
16.
17.
18.
19.
20.
21.
Sl. No.
CapSense series
resistor placement
Distance between
any CapSense trace
to ground flood
Device placement
Placement of
components in two
layer PCB
Placement of
components in four
layer PCB
Overlay thickness
Overlay material
Overlay adhesives
Board thickness
Category
10 mil
–
–
–
0 mm
–
–
–
Min
–
Layout Guidelines and Best Practices on page
Figure 16. CapSense Button Shapes
Figure 17. Button Layout Design
20 mil
–
–
–
5 mm
–
–
–
10 mm
Max
Place CapSense series resistors close to the device for noise
suppression.CapSense resistors have highest priority compared to
other resistors, so place them first.
20 mil
Mount the device on the layer opposite to sensor. The CapSense trace
length between the device and sensors should be minimum (see trace
length above)
Top layer-Sensors and bottom layer-device, other components and
traces.
Top layer-Sensors, second layer – CapSense traces & Vdd and avoid
the Vdd traces below the sensors, third layer-hatched ground, Bottom
layer- device other components and non CapSense traces
Use layout estimator sheet to decide on overlay, given maximum limit is
for plastic overlay.
Should to be non-conductive material. Glass, ABS Plastic, Formica,
wood etc. No air gap should be there between PCB and overlay. Use
adhesive to stick the PCB and overlay.
Adhesive should be non conductive and dielectrically homogenous.
467 MP and 468 MP adhesives made by 3 M are recommended.
Standard board thickness for CapSense FR4 based designs is 1.6 mm.
Recommendations/Remarks
16)
CY8CMBR2016
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