MPC8536EAVTATLA Freescale Semiconductor, MPC8536EAVTATLA Datasheet - Page 123

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MPC8536EAVTATLA

Manufacturer Part Number
MPC8536EAVTATLA
Description
Microprocessors - MPU 8536 ENCRYPTED
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8536EAVTATLA

Product Category
Microprocessors - MPU
Rohs
yes
Processor Series
PowerQUICC III
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
250 MHz
Program Memory Size
32 KB
Data Ram Size
512 KB
Interface Type
I2C, USB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
0 C to + 105 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-783
5
This section details package parameters, pin assignments, and dimensions.
5.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 flip chip plastic ball
grid array (FC-PBGA) without a lid.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Solder Balls
Ball diameter (typical)
Package Information
Package Parameters for the FC-PBGA
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
29 mm × 29 mm
783
1 mm
2.23 mm
2.8 mm
96.5Sn/3.5Ag
0.6 mm
Package Information
123

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