ECMF06-6AM16 STMicroelectronics, ECMF06-6AM16 Datasheet
ECMF06-6AM16
Specifications of ECMF06-6AM16
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ECMF06-6AM16 Summary of contents
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... The ECMF06-6AM16 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY or MDDI. The ECMF06-6AM16 can protect and filter 3 differential lanes. October 2012 This is information on a product in full production. Common mode filter with ESD protection for MIPI D-PHY and MDDI interface µ ...
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... Parameter IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Parameter Breakdown voltage Leakage current @ V RM Stand-off voltage Breakdown current °C) amb Min. 6 Doc ID 022284 Rev 2 ECMF06-6AM16 Value 10 30 100 -40 to +85 125 - 55 to +150 Typ. Max. ...
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... ECMF06-6AM16 Table 3. Pin description Pin Description name D0+ 1 DSI receiver D0- 2 DSI receiver GND 3 DSI receiver D1+ 4 DSI receiver Figure 3. SDD21 differential attenuation measurement (Z SDD21 (dB) 0 -0.5 -1 -1.5 -2 -2.5 -3 100k Pin Pin Description name name D1 DSI receiver DSI transmitter GND 6 10 DSI receiver ...
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... SCC21 common mode attenuation measurement (Z SCC21 (dB -10 -15 -20 -25 -30 -35 -40 100k Figure 5. SDD11 differential return loss measurement (Z -5 -10 -15 -20 -25 -30 -35 -40 -45 4/16 1M 10M F/ SDD11 (dB) 0 10M 30M 100M F/ Doc ID 022284 Rev 2 ECMF06-6AM16 = 50 ) 0 com 100M 100 ) 0 diff 300M ...
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... ECMF06-6AM16 Figure 6. SDD22 differential attenuation measurement ( -10 -15 -20 -25 -30 -35 -40 Figure 7. SDDxx inter-lane differential cross-coupling measurement (Z SDDxx (dB) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 100k SDD22 (dB) 10M 30M 100M F/ 10M F/Hz D0-D1 Doc ID 022284 Rev 2 Characteristics = 100 ) 0 diff 300M 1G 3G ...
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... Figure 9. MIPI D-PHY low power mode test setup Generator Agilent 81110 Pattern mode MHz modulation RZ, 50 6/16 = 100 ) 1M 10M F/Hz D0-D1 Ω output CMF Doc ID 022284 Rev 2 ECMF06-6AM16 100M 1G D0-D2 Oscilloscope Lecroy Ω 7300 input ...
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... ECMF06-6AM16 Figure 10. Low power pulse response - see 500 mV/div 500 mV/div Figure 11. ESD response to IEC61000-4-2 (+8 kV contact discharge) - see 50 V/div Dx+ Dx- Figure 13 for test set- 122 Doc ID 022284 Rev 2 Characteristics Figure 9 for test setup ...
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... -120 V D0+ D0- GND D1+ D1- GND D2+ D2- Doc ID 022284 Rev 2 ECMF06-6AM16 ESD peak voltage :clamping voltage @ :clamping voltage @ :clamping voltage @ 100 ns/div attenuator ...
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... ECMF06-6AM16 2 Application information Figure 14. Application information Display DSI Receiver D0+ D0- GND D1+ D1- GND CLK+ CLK- Doc ID 022284 Rev 2 Application information Application processor DSI Transmitter D0+ D0- GND D1+ D1- GND CLK+ CLK- 9/16 ...
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... Figure 15. Ordering information scheme 10/16 Function Common mode filter with ESD protection Number of filtered lines yy = Number of filtered lines Number of ESD protected lines lines with ESD protection Version z = Version Package M = µQFN, pitch 400 µ pads Doc ID 022284 Rev 2 ECMF06-6AM16 ECMF M16 ...
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... ECMF06-6AM16 4 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. ...
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... Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 20. Recommended stencil window position 10 µm 180 µm 200 µm 12/ = ---- - 1,5 T = --------------------------- - 0,66 µm 0.60 Stencil window Footprint Doc ID 022284 Rev 2 ECMF06-6AM16 W 0.40 0.20 3.00 1.75 ...
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... ECMF06-6AM16 5.2 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. 5.3 Placement 1. Manual positioning is not recommended. ...
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... Minimize air convection currents in the reflow oven to avoid component movement. 14/16 ® recommended soldering reflow profile for PCB mounting Temperature (° °C/s 0.9 °C 120 150 Doc ID 022284 Rev 2 ECMF06-6AM16 240-245 °C -2 °C/s 60 sec (90 max) -3 °C/s -6 °C/s Time (s) 180 210 240 270 300 ...
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... ECMF06-6AM16 6 Ordering information Table 5. Ordering information Order code ECMF06-6AM16 For the latest information on available order codes see the product pages on www.st.com. 7 Revision history Table 6. Document revision history Date 14-Feb-2012 04-Oct-2012 Marking Package KF µQFN-16L Revision 1 Initial release. 2 Inserted Table 3 and updated ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 16/16 Please Read Carefully: © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 022284 Rev 2 ECMF06-6AM16 ...