MAX9260GCB/V+TGG4 Maxim Integrated, MAX9260GCB/V+TGG4 Datasheet - Page 16

• Manufacturer Part Number: MAX9260GCB/V+TGG4
• Description: Serializers & Deserializers - Serdes Multimedia Serial Link
• Manufacturer: Maxim Integrated
• Type: Deserializerr

Specifications of MAX9260GCB/V+TGG4

• Rohs: yes
• Data Rate: 2.5 Gbit/s
• Input Type: CML
• Output Type: CMOS/LVCMOS
• Number Of Inputs: 1
• Number Of Outputs: 30
• Operating Supply Voltage: 1.7 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: TQFP-64 EP
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT

Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. Use a multilayer
board whenever possible for better noise immunity and
power dissipation. Follow these guidelines for good PCB
layout:
1) Use a large contiguous copper plane under the IC
2) Isolate the power components and high-current path
/V denotes an automotive qualified part.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Future product—contact factory for availability.
**EP = Exposed pad.
PROCESS: BiCMOS
MAX16907RAUE/V+
MAX16907SAUE/V+*
MAX16907RATE/V+
MAX16907SATE/V+*
package. Ensure that all heat-dissipating components
have adequate cooling. The bottom pad of the device
must be soldered down to this copper plane for effec-
tive heat dissipation and for getting the full power out
of the IC. Use multiple vias or a single large via in this
plane for heat dissipation.
from the sensitive analog circuitry. This is essential to
prevent any noise coupling into the analog signals.
PART
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PCB Layout Guidelines
Chip Information
SPREADSPECTURM
36V, 2.2MHz Step-Down Converter
Disabled
Disabled
Enabled
Enabled
with Low Operating Current
3) Keep the high-current paths short, especially at the
4) Keep the power traces and load connections short.
5) The analog signal lines should be routed away from
6) The ground connection for the analog and power
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
16 TSSOP-EP
16 TQFN-EP
PACKAGE
ground terminals. This practice is essential for stable,
jitter-free operation. The high-current path composed
of input capacitor, high-side FET, inductor, and output
capacitor should be as short as possible.
This practice is essential for high efficiency. Use
thick copper PCBs (2oz vs. 1oz) to enhance full-load
efficiency.
the high-frequency planes. This ensures integrity of
sensitive signals feeding back into the IC.
section should be close to the IC. This keeps the
ground current loops to a minimum. In cases where
only one ground is used, enough isolation between
analog return signals and high-power signals must
be maintained.
-40NC to +125NC
-40NC to +125NC
-40NC to +125NC
-40NC to +125NC
TYPE
TEMPRANGE
PACKAGE
T1655+4
U16E+3
CODE
Ordering Information
Package Information
PIN-PACKAGE
16 TSSOP-EP**
16 TSSOP-EP**
16 TQFN-EP**
16 TQFN-EP**
OUTLINE
21-0108
21-0140
MAX16907
NO.
PATTERNNO.
90-0120
90-0121
LAND