FT201XQ-R FTDI, FT201XQ-R Datasheet - Page 44

• Manufacturer Part Number: FT201XQ-R
• Description: USB Interface IC USB to I2C IC QFN-16
• Manufacturer: FTDI

Specifications of FT201XQ-R

• Rohs: yes
• Product: USB 2.0
• Data Rate: 12 Mbps, 480 Mbps
• Interface Type: I2C, USB
• Operating Supply Voltage: 2.97 V to 5.5 V
• Operating Supply Current: 6.4 mA to 8.65 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: QFN-16
• Tradename: X-Chip

11.5 Solder Reflow Profile
The FT201X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 11.5.
Figure 11.5 FT201X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 11.1. Values are shown for
both a completely Pb free solder process (i.e. the FT201X is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT201X is used with non-Pb free solder).
Table 11.1 Reflow Profile Parameter Values
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
25
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2013 Future Technology Devices International Limited
Min to t
(t
T = 25º C to T
T
Preheat
Time, t (seconds)
L
p
:
)
t
S
L
)
s
Max)
s
s
L
)
Min.)
Max.)
P
s
p
)
to T
Ramp Up
p
)
p
Pb Free Solder Process
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
t
p
FT201X USB I2C SLAVE IC Datasheet
150°C
200°C
217°C
260°C
t
L
Document No.: FT_000627 Clearance No.: FTDI# 264
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
Non-Pb Free Solder Process
p
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
Version 1.3
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