TJA1022TK,118 NXP Semiconductors, TJA1022TK,118 Datasheet - Page 21
TJA1022TK,118
Manufacturer Part Number
TJA1022TK,118
Description
LIN Transceivers DUAL LIN 5-18V
Manufacturer
NXP Semiconductors
Datasheet
1.TJA1022T118.pdf
(26 pages)
Specifications of TJA1022TK,118
Rohs
yes
Operating Supply Voltage
5 V to 18 V
Supply Current
10 mA
Package / Case
HVSON-14
Mounting Style
SMD/SMT
Factory Pack Quantity
6000
NXP Semiconductors
17. Soldering of HVSON packages
TJA1022
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Section 16
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can be found in the following application notes:
Fig 9.
•
•
AN10365 “Surface mount reflow soldering description”
AN10366 “HVQFN application information”
temperature
MSL: Moisture Sensitivity Level
Temperature profiles for large and small components
contains a brief introduction to the techniques most commonly used to solder
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 March 2012
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Dual LIN 2.2/SAE J2602 transceiver
temperature
peak
TJA1022
© NXP B.V. 2012. All rights reserved.
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