74AUP2G241GN,115 NXP Semiconductors, 74AUP2G241GN,115 Datasheet - Page 2

• Manufacturer Part Number: 74AUP2G241GN,115
• Description: Buffers & Line Drivers Low-Power dual inverting buffer
• Manufacturer: NXP Semiconductors

Specifications of 74AUP2G241GN,115

• Rohs: yes
• Factory Pack Quantity: 5000

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
74AUP2G241
Product data sheet
Type number
74AUP2G241DC
74AUP2G241GT
74AUP2G241GF
Type number
74AUP2G241DC
74AUP2G241GT
74AUP2G241GF
74AUP2G241GD
74AUP2G241GM
74AUP2G241GN
74AUP2G241GS
74AUP2G241GD
74AUP2G241GM
74AUP2G241GN
74AUP2G241GS
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Ordering information
Marking codes
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C


Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
All information provided in this document is subject to legal disclaimers.
VSSOP8
XSON8
XSON8
XSON8
XQFN8
XSON8
XSON8
Rev. 7 — 11 February 2013
Description
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
plastic extremely thin small outline package; no leads;
8 terminals; body 1  1.95  0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35  1  0.5 mm
plastic extremely thin small outline package; no leads;
8 terminals; body 3  2  0.5 mm
plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6  1.6  0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.2  1.0  0.35 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35  1.0  0.35 mm
Marking code
p41
p41
p1
p41
p41
p1
p1
Low-power dual buffer/line driver; 3-state
[1]
74AUP2G241
© NXP B.V. 2013. All rights reserved.
Version
SOT765-1
SOT833-1
SOT1089
SOT996-2
SOT902-2
SOT1116
SOT1203
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