BD00IA5WEFJ-E2 ROHM Semiconductor, BD00IA5WEFJ-E2 Datasheet - Page 16

• Manufacturer Part Number: BD00IA5WEFJ-E2
• Description: Low Dropout Controllers - LDO LDO Reg Pos Variable Vltg 0.5A
• Manufacturer: ROHM Semiconductor

Specifications of BD00IA5WEFJ-E2

• Rohs: yes
• Input Voltage Max: 5.5 V
• Output Current: 0.5 A
• Load Regulation: 75 mV
• Output Type: Adjustable
• Number Of Outputs: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: HTSOP-8
• Input Voltage Min: 2.4 V
• Maximum Power Dissipation: 2110 mW
• Minimum Operating Temperature: - 25 C

●Operational Notes
TSZ22111･15･001
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BDxxIA5WEFJ
(10) Thermal shutdown circuit
(1) Absolute maximum ratings
(2) Connecting the power supply connector backward
(3) Power supply lines
(4) GND voltage
(5) Thermal design
(6) Off leak in high temperature.
(7) Inter-pin shorts and mounting errors
(8) Actions in strong electromagnetic field
(9) ASO
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Off-leak in high temperature may increase because of manufacturing of IC diviation.
Design in cousideration with graph of typ, worst is shown below.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
BDxxIA5WEFJ
TSD ON Temperature[℃] (typ.)
0.5
0.4
0.3
0.2
0.1
0
25
175
50
Temperature (℃)
Ta-Ileak
75
16/19
100
125
Hysteresis Temperature [℃] (typ.)
worst
typ
150
TSZ02201-0R6R0A600170-1-2
15
9.July.2012 Rev.001
Datasheet