MT48LC8M8A2TG-75:G TR Micron Technology Inc, MT48LC8M8A2TG-75:G TR Datasheet - Page 72
![IC SDRAM 64MBIT 133MHZ 54TSOP](/photos/7/22/72261/557-54-tsop_sml.jpg)
MT48LC8M8A2TG-75:G TR
Manufacturer Part Number
MT48LC8M8A2TG-75:G TR
Description
IC SDRAM 64MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC4M16A2P-75G_TR.pdf
(72 pages)
Specifications of MT48LC8M8A2TG-75:G TR
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (8M x 8)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Organization
8Mx8
Density
64Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
140mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
557-1105-2
Figure 55:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
6.40
54-Ball VFBGA “F4/B4” Package, 8mm x 8mm
0.10 C
BALL A9
3.20
Notes:
0.65 ±0.05
C
1. All dimensions in millimeters.
2. Recommended pad = Ø 0.40mm SMD.
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
0.80 TYP
C L
BALL A1
BALL A1 ID
72
4.00 ±0.05
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.40
64Mb: x4, x8, x16 SDRAM
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.
BALL A1 ID