MT46H16M32LFCM-6:B TR Micron Technology Inc, MT46H16M32LFCM-6:B TR Datasheet - Page 5

• Manufacturer Part Number: MT46H16M32LFCM-6:B TR
• Description: IC DDR SDRAM 512MBIT 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M32LFCM-6:B TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 115mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1381-2

Table 2:
PDF: 09005aef82dfb176 / Source: 09005aef82dfb194
tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN
Bond Pad Order Comparison
Notes:
1. Blue cells indicate bond pad order differences.
For high-speed applications that use the single-sided configuration, special bonding
recommendations are provided in the part-specific die data sheet.
95nm, Double-Sided x16
BOND_OPT
High-Z
CAS#
RAS#
WE#
V
V
V
CKE
V
BA1
BA0
A10
A11
A12
V
V
V
CS#
V
V
V
V
V
V
V
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
BOND_OPT
High-Z
V
V
DQ15
DQ14
V
DQ13
DQ12
DQ11
DQ10
V
UDQS
V
V
LDQS
V
V
V
V
UDM
V
V
LDM
TEST
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
V
V
V
CK#
V
CK#
V
V
V
V
V
V
V
V
V
V
V
TQ
DD
DD
DD
DD
CK
CK
DD
DD
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
1
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
TN-46-16: 512Mb Mobile DDR: 95nm to 78nm
5
78nm, Double-Sided x16
BOND_OPT
A10/AP
High-Z
CAS#
RAS#
TEST
WE#
V
V
A11
A12
V
CKE
BA1
BA0
V
V
CS#
V
V
V
V
V
A4
A5
A6
A7
A8
A9
A0
A1
A2
A3
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
Micron Technology, Inc., reserves the right to change products or specifications without notice.
UDQS
V
V
V
DQ15
DQ14
DQ13
DQ12
V
DQ11
DQ10
V
LDQS
V
V
V
V
V
UDM
V
V
V
V
V
LDM
V
V
V
V
V
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
V
V
CK#
V
V
V
V
V
V
TQ
DD
DD
DD
DD
DD
CK
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
Die Bond Pad Order Changes
DD
DD
DD
DD
SS
SS
SS
SS
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
©2007 Micron Technology, Inc. All rights reserved.