IS62WV51216BLL-55TI ISSI, IS62WV51216BLL-55TI Datasheet - Page 16

• Manufacturer Part Number: IS62WV51216BLL-55TI
• Description: SRAM 8Mb 512Kx16 55ns 2.5v/3.6v
• Manufacturer: ISSI
• Type: Asynchronousr

Specifications of IS62WV51216BLL-55TI

• Product Category: SRAM
• Memory Size: 8 Mbit
• Organization: 512 K x 16
• Access Time: 55 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.5 V
• Maximum Operating Current: 5 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Package / Case: TSOP-44
• Interface: TTL
• Factory Pack Quantity: 135

Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
06/18/03
PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
E1
A
C
D
E
b
e
L
α
N
1
.
Min
Millimeters
20.82 21.08
10.03 10.29
11.56 11.96
—
0.05
0.30
0.12
0.40
0°
1.27 BSC
0.95 REF
ZD
Max
1.20
0.15
0.52
0.21
0.60
5°
e
32
—
Min
D
0.002 0.006
0.012 0.020
0.005 0.008
0.820 0.830
0.391 0.400
0.451 0.466
0.050 BSC
0.016 0.024
0°
Inches
0.037 REF
Max
0.047
5°
Plastic TSOP (T - Type II)
N/2+1
N/2
b
18.31 18.52
10.03 10.29
11.56 11.96
—
Min
Millimeters
0.05
0.30
0.12
0.41
0°
0.80 BSC
0.81 REF
1-800-379-4774
E1
A
Max
1.20
0.15
0.45
0.21
0.60
5°
A1
44
E
—
Min
0.002 0.006
0.012 0.018
0.005 0.008
0.721 0.729
0.395 0.405
0.455 0.471
0.016 0.024
0°
0.032 BSC
Inches
0.032 REF
SEATING PLANE
Max
0.047
5°
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Formed leads shall be planar with
L
unless otherwise specified.
between centers.
include mold flash protrusions and
should be measured from the
bottom of the package.
respect to one another within
0.004 inches at the seating plane.
20.82 21.08
10.03 10.29
11.56 11.96
—
Min
Millimeters
0.05
0.30
0.12
0.80 BSC
0.40
0°
0.88 REF
Max
1.20
0.15
0.45
0.21
0.60
5°
50
—
Min
0.002 0.006
0.012 0.018
0.005 0.008
0.820 0.830
0.395 0.405
0.455 0.471
0.016 0.024
0°
0.031 BSC
0.035 REF
Inches
α
Max
0.047
5°
C