M24256-BWMN6TP STMicroelectronics, M24256-BWMN6TP Datasheet - Page 34
![IC EEPROM 256KBIT 400KHZ 8SOIC](/photos/1/38/13851/497-8-soic_sml.jpg)
M24256-BWMN6TP
Manufacturer Part Number
M24256-BWMN6TP
Description
IC EEPROM 256KBIT 400KHZ 8SOIC
Manufacturer
STMicroelectronics
Datasheets
1.M24256-BWMN6TP.pdf
(42 pages)
2.M24256-BWMN6TP.pdf
(42 pages)
3.M24256-BWMN6TP.pdf
(43 pages)
Specifications of M24256-BWMN6TP
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
256K (32K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Density
256Kb
Interface Type
Serial (I2C)
Organization
32Kx8
Access Time (max)
900ns
Frequency (max)
400KHz
Write Protection
Yes
Data Retention
40Year
Operating Supply Voltage (typ)
3.3/5V
Package Type
SOIC
Operating Temp Range
-40C to 85C
Supply Current
5mA
Operating Supply Voltage (min)
2.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
5 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8623-2
M24256-BWMN6TP
M24256-BWMN6TP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M24256-BWMN6TP
Manufacturer:
ST
Quantity:
5
Part Number:
M24256-BWMN6TP
Manufacturer:
ST
Quantity:
20 000
Package mechanical data
34/42
Figure 17. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 21.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
measuring.
ddd
A1
D2
E2
L1
L3
A
D
E
b
e
L
(2)
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
A
0.55
0.02
0.25
0.45
Typ
1.6
0.2
0.5
2
3
E
A1
millimeters
Doc ID 6757 Rev 23
0.45
0.08
Min
D
0.2
1.9
1.5
2.9
0.1
0.4
0.3
0
-
M24256-BF, M24256-BR, M24256-BW, M24256-DR
Max
0.05
0.15
0.6
0.3
2.1
1.7
3.1
0.3
0.5
ddd
-
L3
0.0098
0.0787
0.0079
0.0177
0.0217
0.0008
0.1181
0.0197
0.063
Typ
D2
e
b
inches
0.0177
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
0.08
UFDFPN-01
Min
SS
0
-
L1
E2
L
. It must not be
(1)
0.0236
0.0118
0.0827
0.0669
0.0118
0.0197
0.0059
0.002
0.122
Max
-