CY62147EV30LL-55ZSXE Cypress Semiconductor Corp, CY62147EV30LL-55ZSXE Datasheet
CY62147EV30LL-55ZSXE
Specifications of CY62147EV30LL-55ZSXE
Related parts for CY62147EV30LL-55ZSXE
CY62147EV30LL-55ZSXE Summary of contents
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... LOW and CE is HIGH LOW. For all other cases CE is HIGH Cypress Semiconductor Corporation Document Number: 38-05440 Rev. *J 4-Mbit (256K x 16) Static RAM also has an automatic power down feature that significantly reduces power consumption when addresses are not toggling. Placing the device into standby mode reduces power consumption by more than 99 percent when deselected (CE HIGH or both BLE and BHE are HIGH) ...
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Contents Product Portfolio .............................................................. 3 Pin Configuration ............................................................. 3 Maximum Ratings ............................................................. 4 Operating Range ............................................................... 4 Electrical Characteristics ................................................. 4 Capacitance ...................................................................... 4 Thermal Resistance........................................................... 5 Data Retention Characteristics ....................................... 5 Switching Characteristics ................................................ 6 Switching Waveforms ...................................................... 7 ...
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... Product Portfolio Product Range Min CY62147EV30LL Industrial 2.2 Pin Configuration Figure 1. 48-Ball VFBGA (Single Chip Enable BLE I/O BHE I/O I I/O I I/O I Notes 2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured ...
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... Document Number: 38-05440 Rev input voltage Output current into outputs (LOW) ............................. 20 mA Static discharge voltage .......................................... >2001 V (MIL-STD-883, method 3015) Latch-up current ...................................................... >200 mA Operating Range Device + 0.3 V) CCmax CY62147EV30LL Industrial –40 °C to +85 ° 0.3 V) CCmax Test Conditions Min 2.0 > 2.70 V 2.4 CC – ...
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Thermal Resistance [11] Parameter Description Thermal resistance JA (junction to ambient) Thermal resistance JC (junction to case OUTPUT INCLUDING JIG AND SCOPE Equivalent to: THEVENIN EQUIVALENT Parameters ...
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... HZCE HZBE HZWE 21. The internal write time of the memory is defined by the overlap of WE signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write. Document Number: 38-05440 Rev. *J Description ...
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Switching Waveforms Figure 6. Read Cycle No. 1: Address Transition Controlled ADDRESS PREVIOUS DATA VALID DATA OUT Figure 7. Read Cycle No Controlled ADDRESS CE t ACE OE t LZOE BHE/BLE t DBE t LZBE HIGH IMPEDANCE DATA ...
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... CE is LOW and 27. The internal write time of the memory is defined by the overlap of WE these signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write. 28. Data I/O is high impedance ...
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Switching Waveforms (continued) Figure 10. Write Cycle No Controlled, OE LOW ADDRESS CE BHE/BLE DATA I/O NOTE 33 t HZWE Figure 11. Write Cycle No. 4: BHE/BLE Controlled, OE LOW ADDRESS CE BHE/BLE t SA ...
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Truth Table CE [34, 35 BHE BLE ...
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... Ordering Information Speed Ordering Code (ns) 45 CY62147EV30LL-45BVI CY62147EV30LL-45BVXI CY62147EV30LL-45B2XI CY62147EV30LL-45ZSXI Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions 621 4 E V30 LL 45 xxx CY 7 Notes 36. This BGA package is offered with single chip enable. 37. This BGA package is offered with dual chip enable. ...
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Package Diagrams Figure 12. 48-Ball VFBGA ( mm), 51-85150 Document Number: 38-05440 Rev. *J ® CY62147EV30 MoBL 51-85150 *F 51-85150 *F Page [+] Feedback ...
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... Package Diagrams (continued) Acronyms Acronym Description CMOS complementary metal oxide semiconductor I/O input/output SRAM static random access memory VFBGA very fine ball grid array TSOP thin small outline package Document Number: 38-05440 Rev. *J Figure 13. 44-Pin TSOP II, 51-85087 Document Conventions Units of Measure Symbol ° ...
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... Added Preliminary Automotive-A information Added footnote #9 related to I Added footnote #14 related AC timing parameters Converted Automotive-A and Automotive -E specs from preliminary to final Added -45B2XI part (Dual CE option) Added CY62147EV30LL-45ZSXA in the ordering information table Updated package diagrams. Added Contents. Updated links in Sales, Solutions, and Legal Added Note 23 ...
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Document Title: CY62147EV30 MoBL Document Number: 38-05440 Orig. of Submission Rev. ECN No. Change *J 3123973 RAME 01/31/2011 Document Number: 38-05440 Rev. *J ® 4-Mbit (256K x 16) Static RAM Description of Change Date Separated Industrial and Auto parts from ...
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... Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement ...