AT45DB021D-SH-T Atmel, AT45DB021D-SH-T Datasheet - Page 23

IC FLASH 2MBIT 66MHZ 8SOIC

AT45DB021D-SH-T

Manufacturer Part Number
AT45DB021D-SH-T
Description
IC FLASH 2MBIT 66MHZ 8SOIC
Manufacturer
Atmel
Datasheets

Specifications of AT45DB021D-SH-T

Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
2M (1024 pages x 264 bytes)
Speed
66MHz
Interface
SPI, RapidS
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Cell Type
NOR
Density
2Mb
Access Time (max)
6ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
SOIC EIAJ
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
256K
Supply Current
15mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT45DB021D-SH-T
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
3638J–DFLASH–5/10
12.2
Operation Mode Summary
The commands described previously can be grouped into four different categories to better describe which
commands can be executed at what times.
Group A commands consist of:
Group B commands consist of:
Group C commands consist of:
Group D commands consist of:
If a Group A command is in progress (not fully completed), then another command in Group A, B, C, or D should
not be started. However, during the internally self-timed portion of Group B commands one through four, any
command in Group C can be executed. During the internally self-timed portion of Group B commands five through
ten, only Group C commands three and four can be executed. Finally, during the internally self-timed portion of a
Group D command, only the Status Register Read command should be executed.
1. Main Memory Page Read
2. Continuous Array Read
3. Read Sector Protection Register
4. Read Sector Lockdown Register
5. Read Security Register
1. Page Erase
2. Block Erase
3. Sector Erase
4. Chip Erase
5. Main Memory Page to Buffer Transfer
6. Main Memory Page to Buffer Compare
7. Buffer to Main Memory Page Program with Built-in Erase
8. Buffer to Main Memory Page Program without Built-in Erase
9. Main Memory Page Program through Buffer
10. Auto Page Rewrite
1. Buffer Read
2. Buffer Write
3. Status Register Read
4. Manufacturer and Device ID Read
1. Erase Sector Protection Register
2. Program Sector Protection Register
3. Sector Lockdown
4. Program Security Register
Atmel AT45DB021D
23

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