EVAL-ADXL362Z-DB Analog Devices, EVAL-ADXL362Z-DB Datasheet - Page 2

• Manufacturer Part Number: EVAL-ADXL362Z-DB
• Description: Acceleration Sensor Development Tools enl Datalogger Board of ADXL362
• Manufacturer: Analog Devices

Specifications of EVAL-ADXL362Z-DB

• Rohs: yes
• Tool Is For Evaluation Of: ADXL362
• Acceleration: 2 g, 4 g, 8 g
• Sensing Axis: Triple Axis
• Interface Type: SPI
• Operating Voltage: 1.6 V to 3.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Current: 1.8 uA
• Output Type: Digital
• Product: Development Boards
• Sensitivity: 1 mg/LSB, 2 mg/LSB, 4 mg/LSB
• Factory Pack Quantity: 1

ADXL362
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 3
Specifications ..................................................................................... 4
Absolute Maximum Ratings ............................................................ 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 13
Power Savings Features .................................................................. 15
Additional Features ........................................................................ 18
Serial Communications ................................................................. 19
Register Map .................................................................................... 23
Register Details ............................................................................... 24
Thermal Resistance ...................................................................... 6
Package Information .................................................................... 6
Recommended Soldering Profile ............................................... 6
ESD Caution .................................................................................. 6
Mechanical Device Operation .................................................. 13
Operating Modes ........................................................................ 13
Selectable Measurement Ranges ............................................... 13
Selectable Output Data Rates .................................................... 13
Power/Noise Tradeoff ................................................................ 14
Ultralow Power Consumption in All Modes .......................... 15
Motion Detection ....................................................................... 15
FIFO ............................................................................................. 17
Communications ........................................................................ 17
Free Fall Detection ..................................................................... 18
External Clock ............................................................................ 18
Synchronized Data Sampling .................................................... 18
Self Test ........................................................................................ 18
User Register Protection ............................................................ 18
Temperature Sensor ................................................................... 18
SPI Commands ........................................................................... 19
Multibyte Transfers .................................................................... 19
Invalid Addresses and Address Folding .................................. 19
Latency Restrictions ................................................................... 19
Invalid Commands ..................................................................... 19
Rev. B | Page 2 of 44
Applications Information .............................................................. 36
Outline Dimensions ....................................................................... 43
Device ID Register ..................................................................... 24
Device ID: 0x1D Register .......................................................... 24
Part ID: 0xF2 Register ................................................................ 24
Silicon Revision ID Register ..................................................... 24
X-Axis Data (8 MSB) Register .................................................. 24
Y-Axis Data (8 MSB) Register .................................................. 24
Z-Axis Data (8 MSB) Register .................................................. 24
Status Register ............................................................................. 25
FIFO Entries Registers ............................................................... 26
X-Axis Data Registers ................................................................ 26
Y-Axis Data Registers ................................................................ 26
Z-Axis Data Registers ................................................................ 26
Temperature Data Registers ...................................................... 26
Soft Reset Register ...................................................................... 26
Activity Threshold Registers ..................................................... 27
Activity Time Register ............................................................... 27
Inactivity Threshold Registers .................................................. 27
Inactivity Time Registers ........................................................... 27
Activity/Inactivity Control Register ........................................ 29
FIFO Control Register ............................................................... 30
FIFO Samples Register .............................................................. 31
INT1/INT2 Function Map Registers ....................................... 31
Filter Control Register ............................................................... 33
Power Control Register ............................................................. 34
Self Test Register ......................................................................... 35
Application Examples ................................................................ 36
Power ............................................................................................ 37
FIFO Modes ................................................................................ 38
Interrupts ..................................................................................... 39
Using Synchronized Data Sampling ........................................ 40
Using an External Clock ............................................................ 41
Using Self Test ............................................................................. 41
Operation at Voltages Other Than 2.0 V ................................ 41
Mechanical Considerations for Mounting .............................. 41
Axes of Acceleration Sensitivity ............................................... 42
Layout and Design Recommendations ................................... 42
Ordering Guide .......................................................................... 43
Data Sheet