SPZB32W1A2.4 STMicroelectronics, SPZB32W1A2.4 Datasheet - Page 13
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SPZB32W1A2.4
Manufacturer Part Number
SPZB32W1A2.4
Description
Zigbee / 802.15.4 Modules Zigbee PRO Module STM32W Chipset
Manufacturer
STMicroelectronics
Datasheet
1.SPZB32W1A2.4.pdf
(18 pages)
Specifications of SPZB32W1A2.4
Product Category
Zigbee / 802.15.4 Modules
Rohs
yes
Frequency Band
2.4 GHz
Sensitivity
- 99 dBm
Operating Supply Voltage
2.1 V to 3.6 V
Supply Current Transmitting
32 mA
Supply Current Receiving
28 mA
Output Power
3 dBm
Antenna Connector Type
Integrated
Maximum Operating Temperature
+ 85 C
Dimensions
26.5 mm x 16.4 mm x 3.9 mm
SPZB32W1x2.4
8
Soldering
The soldering phase must be carefully executed; in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C,
July 2004 recommendations.
Table 7.
Average ramp-up rate (T
Temperature min. (T
Temperature max. (T
Time (T
Temperature T
Time t
Peak temperature (T
Time within 5 °C of actual peak temperature (t
Ramp-down rate
Time from 25 °C to peak temperature
L
S MIN
Time maintained above:
to T
Soldering
L
S MAX
Profile feature
Preheat
S MIN
p
S MAX
)
) (t
SMAX
)
S
)
)
to T
Doc ID 022887 Rev 1
P
)
P
)
PB free assembly
3 °C / sec. max.
8 minutes max.
60 – 100 sec.
40 – 70 sec.
10 – 20 sec.
240 + 0 °C
6 °C / sec.
150 °C
200 °C
217 °C
Soldering
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