SPZB32W1C2.4 STMicroelectronics, SPZB32W1C2.4 Datasheet - Page 13

• Manufacturer Part Number: SPZB32W1C2.4
• Description: Zigbee / 802.15.4 Modules Zigbee PRO Module STM32W Chipset
• Manufacturer: STMicroelectronics

Specifications of SPZB32W1C2.4

• Product Category: Zigbee / 802.15.4 Modules
• Rohs: yes

SPZB32W1x2.4
8
Soldering
The soldering phase must be carefully executed; in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C,
July 2004 recommendations.
Table 7.
Average ramp-up rate (T
Temperature min. (T
Temperature max. (T
Time (T
Temperature T
Time t
Peak temperature (T
Time within 5 °C of actual peak temperature (t
Ramp-down rate
Time from 25 °C to peak temperature
L
S MIN
Time maintained above:
to T
Soldering
L
S MAX
Profile feature
Preheat
S MIN
p
S MAX
)
) (t
SMAX
)
S
)
)
to T
Doc ID 022887 Rev 1
P
)
P
)
PB free assembly
3 °C / sec. max.
8 minutes max.
60 – 100 sec.
40 – 70 sec.
10 – 20 sec.
240 + 0 °C
6 °C / sec.
150 °C
200 °C
217 °C
Soldering
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