ADP2121-1.875EVALZ Analog Devices, ADP2121-1.875EVALZ Datasheet - Page 4

• Manufacturer Part Number: ADP2121-1.875EVALZ
• Description: Power Management IC Development Tools 6MHz Volt Mode Buck 500mA Bumped Die
• Manufacturer: Analog Devices
• Type: DC/DC Converters, Regulators & Controllersr
• Series: ADP2121r

Specifications of ADP2121-1.875EVALZ

• Rohs: yes
• Tool Is For Evaluation Of: ADP2121
• Input Voltage: 2.3 V to 5.5 V
• Output Current: 500 mA
• Factory Pack Quantity: 1

ADP2121
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
EN, MODE to GND
FB, SW to GND
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature
Soldering Conditions
ESD (Electrostatic Discharge)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP2121 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient tempera-
ture does not guarantee that the junction temperature (T
within the specified temperature limits. In applications with
high power dissipation and poor PCB thermal resistance, the
maximum ambient temperature may need to be derated. In
applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits.
Human Body Model
(I
LOAD
≤ 600 mA)
Rating
−0.3 V to +6 V
−0.3 V to VIN
−0.3 V to VIN + 0.2 V
–40°C to +85°C
–40°C to + 125°C
–45°C to +150°C
JEDEC J-STD-020
±4 kV
J
) is
Rev. B | Page 4 of 20
The junction temperature (T
ambient temperature (T
(P
package (θ
from the ambient temperature (T
using the following formula:
The junction-to-ambient thermal resistance (θ
is based on modeling and calculation using a 2- and 4-layer
board. The junction-to-ambient thermal resistance is highly
dependent on the application and board layout. In applications
where high maximum power dissipation exists, close attention
to thermal board design is required.
The value of θ
and environmental conditions. Refer to JEDEC JESD51-9 for
detailed information about board construction.
THERMAL RESISTANCE
The junction-to-ambient thermal resistance of the system (θ
is specified for worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages.
Table
Package Type
6-Ball WLCSP
ESD CAUTION
D
2-Layer Board
4-Layer Board
), and the junction-to-ambient thermal resistance of the
T
J
4
= T
.
JA
A
). Maximum junction temperature (T
+ (P
JA
may vary, depending on PCB material, layout,
D
× θ
JA
)
A
), the power dissipation of the device
J
) of the device is dependent on the
A
) and power dissipation (P
θ
198
105
JA
JA
) of the package
J
) is calculated
Unit
°C/W
°C/W
JA
D
)
)