IS45S32200E-6TLA1 ISSI, Integrated Silicon Solution Inc, IS45S32200E-6TLA1 Datasheet - Page 59
IS45S32200E-6TLA1
Manufacturer Part Number
IS45S32200E-6TLA1
Description
IC SDRAM 64MBIT 166MHZ 86TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet
1.IS45S32200E-7TLA1-TR.pdf
(59 pages)
Specifications of IS45S32200E-6TLA1
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (2Mx32)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
86-TSOPII
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. C
01/28/02
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
A
C
D
E
b
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
—
—
—
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
0°
—
—
Max
1.20
0.15
0.45
0.21
0.60
8°
54
D
—
—
—
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
0°
Inches
—
—
Max
0.047
8°
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
C
D
A
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.16 BSC
11.56 11.96
—
0.05
0.95
0.17
0.12
0.40
0.80 REF
0.61 REF
0°
0.50 BSC
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
8°
.
86
—
Min
0.867 0.8827
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.400 BSC
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
0°
Inches
0.024 BSC
Max
0.047
8°
should be
C
1