PMBT2222 /T3 NXP Semiconductors, PMBT2222 /T3 Datasheet

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PMBT2222 /T3

Manufacturer Part Number
PMBT2222 /T3
Description
Transistors Bipolar - BJT TRANS SW TAPE-11
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMBT2222 /T3

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Single
Transistor Polarity
NPN
Collector- Base Voltage Vcbo
60 V
Collector- Emitter Voltage Vceo Max
30 V
Emitter- Base Voltage Vebo
5 V
Collector-emitter Saturation Voltage
5 V
Gain Bandwidth Product Ft
250 MHz
Dc Collector/base Gain Hfe Min
35 at 0.1 mA at 10 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-23
Continuous Collector Current
0.6 A
Maximum Power Dissipation
250 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
10000
Part # Aliases
PMBT2222,235
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
NPN switching transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD)
plastic package.
Table 1.
Table 2.
[1]
Type number
PMBT2222
PMBT2222A
Symbol
V
I
h
C
FE
CEO
PMBT2222; PMBT2222A
NPN switching transistors
Rev. 6 — 12 November 2010
High current (max. 600 mA)
Low voltage (max. 40 V)
Switching and linear amplification
Pulse test: t
Product overview
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
p
PMBT2222
PMBT2222A
PMBT2222
PMBT2222A
≤ 300 μs; δ ≤ 0.02.
Package
NXP
SOT23
open base
Conditions
V
I
V
I
V
I
C
C
C
CE
CE
CE
= 150 mA
= 500 mA
= 500 mA
= 10 V;
= 10 V;
= 10 V;
JEDEC
TO-236AB
[1]
[1]
[1]
Min
-
-
-
100
30
40
Typ
-
-
-
-
-
-
Product data sheet
PNP complement
PMBT2907A
PMBT2907
Max
30
40
600
300
-
-
mA
Unit
V
V

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PMBT2222 /T3 Summary of contents

Page 1

... PMBT2222; PMBT2222A NPN switching transistors Rev. 6 — 12 November 2010 1. Product profile 1.1 General description NPN switching transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Type number PMBT2222 PMBT2222A 1.2 Features and benefits High current (max. 600 mA) Low voltage (max ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PMBT2222 PMBT2222A 4. Marking Table 5. Type number PMBT2222 PMBT2222A [ placeholder for manufacturing site code PMBT2222_PMBT2222A Product data sheet PMBT2222; PMBT2222A Pinning Description base emitter collector Ordering information Package Name ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7 ...

Page 4

... NXP Semiconductors 7. Characteristics Table 8. ° Symbol I CBO I EBO CEsat PMBT2222_PMBT2222A Product data sheet Characteristics C unless otherwise specified. Parameter Conditions collector-base cut-off current PMBT2222 125 ° collector-base cut-off current PMBT2222A 125 ° emitter-base cut-off ...

Page 5

... NXP Semiconductors Table 8. ° Symbol V BEsat off [1] Pulse test: t PMBT2222_PMBT2222A Product data sheet Characteristics …continued C unless otherwise specified. Parameter Conditions base-emitter saturation I = 150 mA; C voltage PMBT2222 PMBT2222A base-emitter saturation I = 500 mA ...

Page 6

... NXP Semiconductors 8. Test information Fig 1. Fig 2. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMBT2222_PMBT2222A Product data sheet PMBT2222 ...

Page 7

... NXP Semiconductors 9. Package outline Fig 3. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PMBT2222 PMBT2222A [1] For further information and the availability of packing methods, see PMBT2222_PMBT2222A Product data sheet PMBT2222; PMBT2222A 3 ...

Page 8

... NXP Semiconductors 11. Soldering 3 1.7 Fig 4. 2.6 4.6 Fig 5. PMBT2222_PMBT2222A Product data sheet PMBT2222; PMBT2222A 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 Wave soldering footprint SOT23 (TO-236AB) All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 NPN switching transistors ...

Page 9

... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PMBT2222_PMBT2222A v.6 20101112 Modifications: PMBT2222_2222A_5 20040122 PMBT2222_2222A_4 19990427 PMBT2222_3 19970909 PMBT2222_PMBT2222A Product data sheet Data sheet status Product data sheet • Section 4 “Marking”: updated • Figure 1 “Switching time definition”: added • ...

Page 10

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 11

... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...

Page 12

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering ...

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