BCP68-25 /T3 NXP Semiconductors, BCP68-25 /T3 Datasheet
BCP68-25 /T3
Specifications of BCP68-25 /T3
Related parts for BCP68-25 /T3
BCP68-25 /T3 Summary of contents
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... BCP68; BC868; BC68PA NPN medium power transistors Rev. 8 — 18 October 2011 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BCP68 BC868 BC68PA [1] Valid for all available selection groups. 1.2 Features and benefits ...
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... Pulse test Pinning information Table 3. Pin SOT223 SOT89 SOT1061 BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA Quick reference data …continued Parameter Conditions DC current gain selection - 300 s; = 0.02. p Pinning Description ...
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... Valid for all available selection groups. 4. Marking Table 5. Type number BCP68 BCP68-25 BC868 BC868-25 BC68PA BC68-25PA BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA Ordering information [1] Package Name Description SC-73 plastic surface-mounted package with increased heatsink; 4 leads SC-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads HUSON3 plastic thermal enhanced ultra thin small outline package ...
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... Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA Limiting values Parameter Conditions collector-base voltage open emitter collector-emitter voltage ...
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... FR4 PCB, single-sided copper, mounting pad for collector 6 cm (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm (4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint Fig 3. Power derating curves SOT1061 BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA 006aac674 1.5 P tot (W) 1.0 0.5 ...
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... Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient ...
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... FR4 PCB, mounting pad for collector 1 cm Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... FR4 PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... FR4 PCB, mounting pad for collector 6 cm Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers. Rev. 8 — ...
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... FR4 PCB, single-sided copper, mounting pad for collector 1 cm Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA –3 –2 – –3 –2 –1 10 ...
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... FR4 PCB, 4-layer copper, standard footprint Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... FR4 PCB, 4-layer copper, mounting pad for collector 1 cm Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... Symbol I CBO I EBO CEsat [1] Pulse test: t BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA Characteristics C unless otherwise specified. Parameter Conditions collector-base cut-off current 150 emitter-base cut-off current ...
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... 55 C (1) T amb = 25 C (2) T amb = 100 C (3) T amb Fig 17. Base-emitter voltage as a function of collector current; typical values BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA NPN medium power transistors 006aac694 2 (A) 1.6 0 C ...
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... This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 19. Package outline SOT223 (SC-73) Fig 20. Package outline SOT89 (SC-62/TO-243) BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA NPN medium power transistors 6.7 6.3 3.1 2.9 4 7.3 3 ...
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... The indicated -xxx are the last three digits of the 12NC ordering code. Type [2] number BCP68 BC868 BC68PA [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. [3] T1: normal taping [4] T3: 90 rotated taping BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA 1.3 0.35 0.25 1 1.05 0.95 0.3 3 0.2 1.6 1.4 2.1 1.9 Dimensions in mm Packing methods Package ...
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... NXP Semiconductors 11. Soldering 1.3 1.2 (4×) (4×) Fig 22. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 23. Wave soldering footprint SOT223 (SC-73) BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA NPN medium power transistors 7 3.85 3.6 3.5 0 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 8.9 6 2.7 2.7 1.9 1.1 (2×) All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 0.85 4.6 Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243) 3.5 7.6 Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243) BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA 4.75 2.25 2 1.9 1.2 0.2 1.2 1 (3×) 1.5 1.5 0.6 (3×) 0.7 (3×) 3.95 6.6 2.4 0.5 1.8 (2×) 1.9 1.9 1.5 0.7 (2×) 5.3 All information provided in this document is subject to legal disclaimers. Rev. 8 — 18 October 2011 NPN medium power transistors 1 ...
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... NXP Semiconductors 2.3 Reflow soldering is the only recommended soldering method. Fig 26. Reflow soldering footprint SOT1061 (HUSON3) BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA 1.05 0.6 0.55 solder paste = solder lands solder resist occupied area All information provided in this document is subject to legal disclaimers. Rev. 8 — 18 October 2011 NPN medium power transistors 2 ...
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... BCP68_CNV v.2 19970409 BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA Data sheet status Product data sheet The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. ...
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... BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
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... Contact information For more information, please visit: For sales office addresses, please send an email to: BCP68_BC868_BC68PA Product data sheet BCP68; BC868; BC68PA 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 8 — ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BCP68_BC868_BC68PA All rights reserved. Date of release: 18 October 2011 ...