BSP43 T/R NXP Semiconductors, BSP43 T/R Datasheet

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BSP43 T/R

Manufacturer Part Number
BSP43 T/R
Description
Transistors Bipolar - BJT TRANS MED PWR TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BSP43 T/R

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Single
Transistor Polarity
NPN
Collector- Base Voltage Vcbo
90 V
Collector- Emitter Voltage Vceo Max
80 V
Emitter- Base Voltage Vebo
5 V
Collector-emitter Saturation Voltage
5 V
Gain Bandwidth Product Ft
100 MHz
Dc Collector/base Gain Hfe Min
30 at 100 uA at 5 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-223
Continuous Collector Current
1 A
Maximum Power Dissipation
1300 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
1000
Part # Aliases
BSP43,115
Product data sheet
Supersedes data of 1997 Sep 05
dbook, halfpage
DATA SHEET
BSP41; BSP43
NPN medium power transistors
DISCRETE SEMICONDUCTORS
M3D087
1999 Apr 26

Related parts for BSP43 T/R

BSP43 T/R Summary of contents

Page 1

... DATA SHEET dbook, halfpage BSP41; BSP43 NPN medium power transistors Product data sheet Supersedes data of 1997 Sep 05 DISCRETE SEMICONDUCTORS M3D087 1999 Apr 26 ...

Page 2

... NXP Semiconductors NPN medium power transistors FEATURES • High current (max • Low voltage (max. 80 V). APPLICATIONS • Telephony and general industrial applications • Thick and thin-film circuits. DESCRIPTION NPN medium power transistor in a SOT223 plastic package. PNP complements: BSP31; BSP32 and BSP33. ...

Page 3

... NXP Semiconductors NPN medium power transistors THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th j-a R thermal resistance from junction to soldering point th j-s Note 1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook” ...

Page 4

... NXP Semiconductors NPN medium power transistors PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 1999 Apr ...

Page 5

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 6

... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...

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