PMP5201Y /T3 NXP Semiconductors, PMP5201Y /T3 Datasheet - Page 9

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PMP5201Y /T3

Manufacturer Part Number
PMP5201Y /T3
Description
Transistors Bipolar - BJT MATCHED PAIR
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMP5201Y /T3

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Dual
Transistor Polarity
PNP
Collector- Base Voltage Vcbo
50 V
Collector- Emitter Voltage Vceo Max
45 V
Emitter- Base Voltage Vebo
5 V
Collector-emitter Saturation Voltage
5 V
Gain Bandwidth Product Ft
175 MHz
Dc Collector/base Gain Hfe Min
200 at 2 mA at 5 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-363
Continuous Collector Current
0.1 A
Maximum Power Dissipation
300 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
10000
Part # Aliases
PMP5201Y,135
NXP Semiconductors
10. Packing information
11. Soldering
PMP5201V_G_Y_3
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package Description
PMP5201V
PMP5201G
PMP5201Y
Fig 14. Reflow soldering footprint SOT666
2
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
1.7
1.075
Reflow soldering is the only recommended soldering method.
Packing methods
0.538
PMP5201V; PMP5201G; PMP5201Y
SOT666
SOT353
SOT363
0.55
(2 )
Rev. 03 — 28 August 2009
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
0.45
(4 )
(4 )
0.5
2.75
2.45
2.1
1.6
1.7
0.65
(2 )
(2 )
0.6
PNP/PNP matched double transistors
(6 )
0.4
0.325
0.25
(2 )
(4 )
Section
[2]
[3]
0.375
(2 )
(4 )
0.3
[1]
Packing quantity
3000 4000 8000 10000
-
-
-115
-115
-125
14.
Dimensions in mm
-
-115
-
-
-
© NXP B.V. 2009. All rights reserved.
-315
-
-
-
-
solder lands
placement area
solder paste
occupied area
sot666_fr
-
-
-135
-135
-165
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