BCM857BS T/R NXP Semiconductors, BCM857BS T/R Datasheet
BCM857BS T/R
Specifications of BCM857BS T/R
Related parts for BCM857BS T/R
BCM857BS T/R Summary of contents
Page 1
... BCM857BV; BCM857BS; BCM857DS PNP/PNP matched double transistors Rev. 06 — 28 August 2009 1. Product profile 1.1 General description PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors are fully isolated internally. Table 1. Type number BCM857BV BCM857BS BCM857DS 1.2 Features I Current gain matching ...
Page 2
... NXP Semiconductors Table 2. Symbol Per device h /h FE1 FE2 V V BE1 [1] The smaller of the two values is taken as the numerator. [2] The smaller of the two values is subtracted from the larger value. 2. Pinning information Table 3. Pin Ordering information Table 4. Type number ...
Page 3
... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
Page 4
... NXP Semiconductors Table 7. Symbol Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless otherwise specified amb Symbol Per transistor I CBO I EBO h FE ...
Page 5
... NXP Semiconductors Table unless otherwise specified amb Symbol Per device h /h FE1 FE2 V V BE1 [1] V BEsat [ [3] The smaller of the two values is taken as the numerator. [4] The smaller of the two values is subtracted from the larger value. ...
Page 6
... NXP Semiconductors 0.20 I (mA (A) 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values 1.3 V BEsat (V) 1.1 0.9 (1) (2) 0.7 (3) 0.5 0 amb ( amb ( 100 C amb Fig 3. Base-emitter saturation voltage as a function of collector current; typical values ...
Page 7
... NXP Semiconductors (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF MHz amb Fig 7. Collector capacitance as a function of collector-base voltage; typical values BCM857BV_BS_DS_6 Product data sheet ...
Page 8
... NXP Semiconductors 8. Application information TR1 006aaa524 Fig 9. Current mirror 9. Package outline 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 1 2 0.5 1 Dimensions in mm Fig 11. Package outline SOT666 Fig 13. Package outline SOT457 (SC-74) BCM857BV_BS_DS_6 Product data sheet l out TR2 Fig 10. Differential amplifier 0.6 0.5 4 0.3 0.1 2.2 2.0 3 0.18 0.27 0.08 0.17 Dimensions in mm 04-11-08 Fig 12. Package outline SOT363 (SC-88) 3 ...
Page 9
... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BCM857BV BCM857BS BCM857DS [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BCM857BV_BS_DS_6 Product data sheet ...
Page 10
... NXP Semiconductors 11. Soldering 2 1.7 Fig 14. Reflow soldering footprint SOT666 Fig 15. Reflow soldering footprint SOT363 (SC-88) BCM857BV_BS_DS_6 Product data sheet 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2 ) 1 Reflow soldering is the only recommended soldering method. 2.65 2.35 1.5 0 1.8 Rev. 06 — 28 August 2009 BCM857BV/BS/DS PNP/PNP matched double transistors ...
Page 11
... NXP Semiconductors 4.5 Fig 16. Wave soldering footprint SOT363 (SC-88) Fig 17. Reflow soldering footprint SOT457 (SC-74) BCM857BV_BS_DS_6 Product data sheet 1.3 1.3 2.45 5.3 3.45 1.95 0.95 3.30 2.825 1.60 1.70 3.10 3.20 Dimensions in mm Rev. 06 — 28 August 2009 BCM857BV/BS/DS PNP/PNP matched double transistors 1.5 0.3 2.5 1.5 Dimensions in mm preferred transport direction during soldering solder lands solder resist 0.45 0.55 occupied area ...
Page 12
... NXP Semiconductors 5.05 Fig 18. Wave soldering footprint SOT457 (SC-74) BCM857BV_BS_DS_6 Product data sheet 5.30 1.40 4.30 Dimensions in mm Rev. 06 — 28 August 2009 BCM857BV/BS/DS PNP/PNP matched double transistors solder lands 0.45 1.45 4.45 solder resist occupied area msc423 © NXP B.V. 2009. All rights reserved ...
Page 13
... Document ID Release date BCM857BV_BS_DS_6 20090828 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 12 “Package outline SOT363 • Figure 14 “Reflow soldering footprint • ...
Page 14
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 15
... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history ...