IS42S16160B-7BLI ISSI, Integrated Silicon Solution Inc, IS42S16160B-7BLI Datasheet - Page 62
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IS42S16160B-7BLI
Manufacturer Part Number
IS42S16160B-7BLI
Description
IC SDRAM 256MBIT 143MHZ 54BGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheet
1.IS42S16160B-7TLI-TR.pdf
(62 pages)
Specifications of IS42S16160B-7BLI
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
54-BGA
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
6.5/5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
130mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS42S16160B-7BLI
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
Company:
Part Number:
IS42S16160B-7BLI-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc.
Rev. D
03/13/07
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
C
D
A
b
E
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
—
—
—
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
0°
—
—
Max
1.20
0.15
0.45
0.21
0.60
8°
54
D
—
—
—
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
0°
Inches
—
—
Max
0.047
8°
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
A
C
D
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
—
0.05
0.95
0.17
0.12
0.40
0.80 REF
0°
0.50 BSC
0.61 REF
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
8°
.
86
—
Min
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.395 0.405
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
0°
Inches
0.024 BSC
Max
0.047
8°
should be
C
1