MT47H128M8HQ-3 L:G Micron Technology Inc, MT47H128M8HQ-3 L:G Datasheet - Page 21
MT47H128M8HQ-3 L:G
Manufacturer Part Number
MT47H128M8HQ-3 L:G
Description
IC DDR2 SDRAM 1GBIT 3NS 60FBGA
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H128M8HQ-3 L:G
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (128M x 8)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-FBGA
Organization
128Mx8
Density
1Gb
Address Bus
17b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
10 ±0.1
60X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
8 CTR
0.8 TYP
0.155
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
8
Nonconductive
36%Pb, 2% Ag).
7
overmold
1.8 CTR
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
K
L
A
J
21
A
Ball A1 ID
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.1 ±0.1
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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