MT46H64M32L2CG-6 IT:A Micron Technology Inc, MT46H64M32L2CG-6 IT:A Datasheet - Page 12

• Manufacturer Part Number: MT46H64M32L2CG-6 IT:A
• Description: IC DDR SDRAM 2GBIT 152VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT46H64M32L2CG-6 IT:A

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 2G (64M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 152-VFBGA
• Organization: 64Mx32
• Address Bus: 15b
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
Rev. E, Production. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/09
Rev. D, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1/09
Rev. C, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/08
Rev. B, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/08
Rev. A, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/08
PDF: 09005aef833913f1/Source: 09005aef833913d6
ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN
• Table 3, “Ball Assignments,” on page 6: Deleted ball numbers.
• Table 4, “Non-Device-Specific Ball Assignments,” on page 6: Deleted ball numbers.
• Table 5, “Absolute Maximum Ratings,” on page 7: Added note.
• Table 6, “Recommended Operating Conditions,” on page 7: Updated symbol for I/O
• Added 4Gb option and updated these items to reflect the addition:
• Removed references to reduced-page-size devices.
• Figure 4: “152-Ball VFBGA Functional Block Diagram (non-Quad Die),” on page 8:
• Figure 6: “152-Ball VFBGA Package, 1.0mm (Package Code: CG),” on page 10 and
• Updated template and standards.
• Added Table 2, “152-Ball Production Marketing Part Numbers,” on page 3.
• Added reduced page-size options (LA and LG) to Table 1, “Configuration Addressing,”
• Initial release.
supply voltage.
– “MT46HxxxMxxLxKZ” on page 1
– “Options” on page 1
– Table 1, “Configuration Addressing,” on page 1, including note 1
– Table 2, “152-Ball Production Marketing Part Numbers,” on page 3, part number
– Figure 1: “Marketing Part Number Example,” on page 2
– Figure 3: “152-Ball VFBGA Ball Assignments,” on page 5
– Table 4, “Non-Device-Specific Ball Assignments,” on page 6
– Added Figure 5: “152-Ball VFBGA Functional Block Diagram, Quad Die,” on page 9
– Added Figure 7: “152-Ball VFBGA Package, 1.2mm (Package Code: KZ),” on page 11.
Added parenthetic comment to title.
Figure 7: “152-Ball VFBGA Package, 1.2mm (Package Code: KZ),” on page 11: Added
package codes to figure titles.
on page 1; Figure 1: “Marketing Part Number Example,” on page 2; “General Descrip-
tion” on page 4.
152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP)
12
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Revision History