CY7C1371D-133AXC Cypress Semiconductor Corp, CY7C1371D-133AXC Datasheet - Page 18
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CY7C1371D-133AXC
Manufacturer Part Number
CY7C1371D-133AXC
Description
IC SRAM 18MBIT 133MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet
1.CY7C1373D-100AXC.pdf
(33 pages)
Specifications of CY7C1371D-133AXC
Memory Size
18M (512K x 36)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
6.5 ns
Maximum Clock Frequency
133 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
210 mA
Organization
1 M x 18, 512 K x 36
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Ports
4
Operating Supply Voltage
3.3 V
Memory Configuration
512K X 36
Supply Voltage Range
3.135V To 3.6V
Memory Case Style
TQFP
No. Of Pins
100
Operating Temperature Range
0°C To +70°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2139
CY7C1371D-133AXC
CY7C1371D-133AXC
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1371D-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Company:
Part Number:
CY7C1371D-133AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Identification Register Definitions
Scan Register Sizes
Identification Codes
Document Number: 38-05556 Rev. *I
Revision number (31:29)
Device depth (28:24)
Device width (23:18)
Cypress device ID (17:12)
Cypress JEDEC ID Code (11:1)
ID register presence indicator (0)
Instruction
Bypass
ID
Boundary Scan Order (119-ball BGA package)
Boundary Scan Order (165-ball FBGA package)
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
Instruction
Instruction Field
Register Name
Code
000
001
010
011
100
101
110
111
Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to high Z state.
Loads the ID register with the vendor ID code and places the register between TDI and
TDO. This operation does not affect SRAM operations.
Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a high Z state.
Do Not Use: This instruction is reserved for future use.
Captures IO ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation.
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
00000110100
CY7C1371D
(512 K × 36)
001001
100101
01011
000
1
00000110100
CY7C1373D
(1 M × 18)
Bit Size (× 36)
001001
010101
01011
000
1
32
85
89
3
1
Description
Describes the version number
Reserved for internal use
Defines memory type and architecture
Defines width and density
Allows unique identification of SRAM vendor
Indicates the presence of an ID register
Description
Bit Size (× 18)
32
85
89
3
1
CY7C1371D
CY7C1373D
Page 18 of 33
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