MT46V16M16P-6T L:F TR Micron Technology Inc, MT46V16M16P-6T L:F TR Datasheet - Page 24
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MT46V16M16P-6T L:F TR
Manufacturer Part Number
MT46V16M16P-6T L:F TR
Description
IC DDR SDRAM 256MBIT 6NS 66TSOP
Manufacturer
Micron Technology Inc
Datasheet
1.MT46V16M16CY-5BK_TR.pdf
(93 pages)
Specifications of MT46V16M16P-6T L:F TR
Format - Memory
RAM
Memory Type
DDR SDRAM
Memory Size
256M (16Mx16)
Speed
6ns
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
0°C ~ 70°C
Package / Case
66-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 14:
Table 15:
Table 16:
Table 17:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Parameter
Parameter
Parameter
Parameter
Delta input/output capacitance: DQ0–DQ3 (x4), DQ0–DQ7 (x8)
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, DQS, DM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ, DQS, DM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, DQS, DM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ0–DQ7, LDQS, LDM
Delta input/output capacitance: DQ8–DQ15, UDQS, UDM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, LDQS, UDQS, LDM, UDM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ0–DQ7, LDQS, LDM
Delta input/output capacitance: DQ8–DQ15, UDQS, UDM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, LDQS, UDQS, LDM, UDM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Capacitance (x4, x8 TSOP)
Note: 14 applies to the entire table; Notes appear on page 35
Capacitance (x4, x8 FBGA)
Note: 14 applies to the entire table; Notes appear on page 35
Capacitance (x16 TSOP)
Note: 14 applies to the entire table; Notes appear on page 35
Capacitance (x16 FBGA)
Note: 14 applies to the entire table; Notes appear on page 35
22
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
Symbol
Symbol
Symbol
Electrical Specifications – DC and AC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
IO
IO
IO
IO
I
I
I
I
I
I
I
I
I
I
I
I
IOU
IOU
IOL
IOL
1
2
3
1
2
3
1
2
3
1
2
3
IO
IO
I
I
I
I
I
I
I
I
1
2
1
2
1
2
1
2
256Mb: x4, x8, x16 DDR SDRAM
Min
Min
Min
Min
4.0
2.0
2.0
2.0
3.5
1.5
1.5
1.5
4.0
2.0
2.0
2.0
3.5
1.5
1.5
1.5
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Max
Max
Max
Max
0.50
0.50
0.25
0.50
0.50
0.25
0.50
0.50
0.50
0.25
0.50
0.50
0.50
0.25
©2003 Micron Technology, Inc. All rights reserved.
5.0
3.0
3.0
3.0
4.5
2.5
2.5
2.5
5.0
3.0
3.0
3.0
4.5
2.5
2.5
2.5
Units
Units
Units
Units
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Notes
Notes
Notes
Notes
25
30
30
25
30
30
25
25
30
30
25
25
30
30