MT47H256M4BT-3:A Micron Technology Inc, MT47H256M4BT-3:A Datasheet - Page 75
![IC DDR2 SDRAM 1GBIT 3NS 92FBGA](/photos/7/26/72643/557-92-fbga_sml.jpg)
MT47H256M4BT-3:A
Manufacturer Part Number
MT47H256M4BT-3:A
Description
IC DDR2 SDRAM 1GBIT 3NS 92FBGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H256M4HQ-5EE_TR.pdf
(131 pages)
Specifications of MT47H256M4BT-3:A
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
1G (256M x 4)
Speed
3ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
92-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M4BT-3:A
Manufacturer:
Micron Technology Inc
Quantity:
10 000
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Burst Length
Figure 35: MR Definition
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Notes:
Burst length is defined by bits M0–M2, as shown in Figure 35. Read and write accesses
to the DDR2 SDRAM are burst-oriented, with the burst length being programmable to
either four or eight. The burst length determines the maximum number of column loca-
tions that can be accessed for a given READ or WRITE command.
When a READ or WRITE command is issued, a block of columns equal to the burst
length is effectively selected. All accesses for that burst take place within this block,
meaning that the burst will wrap within the block if a boundary is reached. The block is
uniquely selected by A2–Ai when BL = 4 and by A3–Ai when BL = 8 (where Ai is the most
significant column address bit for a given configuration). The remaining (least signifi-
cant) address bit(s) is (are) used to select the starting location within the block. The
programmed burst length applies to both read and write bursts.
0
BA2
16
M15
1. M16 (BA2) is only applicable for densities ≥1Gb, reserved for future use, and must be
2. Mode bits (Mn) with corresponding address balls (An) greater than M12 (A12) are re-
3. Not all listed WR and CL options are supported in any individual speed grade.
1
0
0
1
1
BA1
15
MR
M14
programmed to “0.”
served for future use and must be programmed to “0.”
14
BA0
M12
0
1
0
1
0
1
0
M11
n
An
Extended mode register (EMR2)
Extended mode register (EMR3)
0
0
0
0
1
1
1
1
Extended mode register (EMR)
(low power)
PD Mode
Slow exit
2
(normal)
PD
Fast exit
Mode Register Definition
12
M10
A12 A11
0
0
1
1
0
0
1
1
Mode register (MR)
11
M9
0
1
0
1
0
1
0
1
WR
10
A10
Write Recovery
9
Reserved
A9
M8
DLL TM
0
1
2
3
4
5
6
7
8
8
A8
M7
DLL Reset
0
1
7
A7 A6 A5 A4 A3
Yes
No
CAS#
Normal
Mode
6
Test
Latency
5
M6
75
0
0
0
0
1
1
1
1
4
M5
BT
0
0
1
1
0
0
1
1
3
M3
0
1
M4
Burst Length
M2
0
1
0
1
0
1
0
1
0
0
0
0
1
1
1
1
2
A2 A1 A0
M1
0
0
1
1
0
0
1
1
1
M0
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0
1
0
1
0
1
0
1
CAS Latency (CL)
Burst Type
Interleaved
Sequential
0
Burst Length
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
3
4
5
6
7
Address Bus
Mode Register (Mx)
4
8
1Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
© 2004 Micron Technology, Inc. All rights reserved.
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