MT48H8M32LFB5-10 IT Micron Technology Inc, MT48H8M32LFB5-10 IT Datasheet - Page 57

• Manufacturer Part Number: MT48H8M32LFB5-10 IT
• Description: IC SDRAM 256MBIT 100MHZ 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-10 IT

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 100MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Density: 256Mb
• Address Bus: 14b
• Access Time (max): 17/8/7ns
• Maximum Clock Rate: 104MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 65mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 35: Power-Down Mode
PDF: 09005aef80d460f2/Source: 09005aef80cd8d41
256Mb SDRAM x32_2.fm - Rev. G 6/05
DQML, DQMU
COMMAND
A0-A9, A11
Precharge all
BA0, BA1
active banks
CLK
CKE
A10
DQ
t CMS
High-Z
t CKS
t AS
SINGLE BANK
PRECHARGE
ALL BANKS
BANK(S)
T0
t CMH
t CKH
t AH
Note:
Two clock cycles
All banks idle, enter
power-down mode
t CK
Violating refresh requirements during power-down may result in a loss of data.
See Table 15, Electrical Characteristics and Recommended AC Operating Conditions, on
page 48.
T1
NOP
t CKS
t CL
T2
NOP
Input buffers gated off while in
power-down mode
t CH
57
Exit power-down mode
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
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256Mb: x32 Mobile SDRAM
t CKS
Tn + 1
NOP
©2003 Micron Technology, Inc. All rights reserved.
All banks idle
Timing Diagrams
Tn + 2
ACTIVE
ROW
ROW
BANK
DON’T CARE