MT46H32M16LFCK-6 IT TR Micron Technology Inc, MT46H32M16LFCK-6 IT TR Datasheet
MT46H32M16LFCK-6 IT TR
Specifications of MT46H32M16LFCK-6 IT TR
Related parts for MT46H32M16LFCK-6 IT TR
MT46H32M16LFCK-6 IT TR Summary of contents
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... MT46H16M32LFCM-75 IT MT46H32M16LFCK-6 MT46H32M16LFCK-6 IT MT46H32M16LFCK-75 MT46H32M16LFCK-75 IT Status Read Register for 78nm Product The status read register (SRR) has been added to the 78nm product used to read the manufacturer ID, revision ID, refresh multiplier, width, type, and density of the Mobile SDRAM, as shown in Figure 1 on page 2. The information made available from this read- only register can assist the component package manufacturer ...
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Figure 1: Status Read Register DQ31...DQ16 DQ15 DQ14 DQ13 31... Reserved Density S15 S14 S13 Density 128Mb 256Mb 512Mb 1,024Mb 0 0 Reserved 1 1 ...
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Package Differences The 95nm, x16 and x32 products use SAC305 package solder ball composition, as shown in Figure 2. Both the x16 (60-ball) and the x32 (90-ball) packages for the 78nm product use SAC105 solder ball composition. This aligns with ...
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Figure 3: New 78nm, x16 9mm, 60-ball VFBGA Seating plane A 0.1 A 60x Ø0.45 Dimensions apply to solder balls post-reflow. The pre-reflow balls are Ø0.42 on Ø0.4 SMD ball pads. 3.6 7.2 0.8 TYP ...
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Table 2: Bond Pad Order Comparison 95nm, Double-Sided x16 BOND_OPT CKE CAS# RAS BA1 BA0 WE# ...
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Summary Micron periodically offers product performance improvements through process node migration. This is the case with the product transition from 95nm to 78nm. Designers should consult product data sheets for detailed information on product differences before proceeding with product transitions. ...