M25P64-VMF6P NUMONYX, M25P64-VMF6P Datasheet - Page 13

no-image

M25P64-VMF6P

Manufacturer Part Number
M25P64-VMF6P
Description
IC FLASH 64MBIT 50MHZ 16SOIC
Manufacturer
NUMONYX
Series
Forté™r
Datasheets

Specifications of M25P64-VMF6P

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
50MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC
Memory Configuration
8M X 8
Ic Interface Type
Serial, SPI
Clock Frequency
75MHz
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
SOIC
No. Of Pins
16
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M25P64-VMF6P
Manufacturer:
ST
Quantity:
7 093
Part Number:
M25P64-VMF6P
Manufacturer:
ST
0
Part Number:
M25P64-VMF6P
Manufacturer:
ST
Quantity:
20 000
Part Number:
M25P64-VMF6P,M25P64-VMF6TP
Manufacturer:
ADI
Quantity:
379
Part Number:
M25P64-VMF6P-6JBS
Manufacturer:
RENESAS
Quantity:
1 350
Part Number:
M25P64-VMF6P-6JBS
Manufacturer:
ST
0
Part Number:
M25P64-VMF6P/XDY7S6JBS99-6E
Manufacturer:
ST
0
Part Number:
M25P64-VMF6PG
Manufacturer:
ST
0
4
4.1
4.2
4.3
4.4
Operating features
Page Programming
To program one data byte, two instructions are required: Write Enable (WREN), which is
one byte, and a Page Program (PP) sequence, which consists of four bytes plus data. This
is followed by the internal Program cycle (of duration t
To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be
programmed at a time (changing bits from 1 to 0), provided that they lie in consecutive
addresses on the same page of memory.
For optimized timings, it is recommended to use the Page Program (PP) instruction to
program all consecutive targeted Bytes in a single sequence versus using several Page
Program (PP) sequences with each containing only a few Bytes (see
and
Sector Erase and Bulk Erase
The Page Program (PP) instruction allows bits to be reset from 1 to 0. Before this can be
applied, the bytes of memory need to have been erased to all 1s (FFh). This can be
achieved either a sector at a time, using the Sector Erase (SE) instruction, or throughout the
entire memory, using the Bulk Erase (BE) instruction. This starts an internal Erase cycle (of
duration t
The Erase instruction must be preceded by a Write Enable (WREN) instruction.
Polling during a Write, Program or Erase cycle
A further improvement in the time to Write Status Register (WRSR), Program (PP) or Erase
(SE or BE) can be achieved by not waiting for the worst case delay (t
Write In Progress (WIP) bit is provided in the Status Register so that the application program
can monitor its value, polling it to establish when the previous Write cycle, Program cycle or
Erase cycle is complete.
Fast Program/Erase mode
The Fast Program/Erase mode is used to speed up programming/erasing. The device
enters the Fast Program/Erase mode during the Page Program, Sector Erase, or Bulk
Erase
The use of the Fast Program/Erase mode requires specific operating conditions in addition
to the normal ones (V
1. Avoid applying VPPH to the W/VPP pin during Bulk Erase with process technology T9HX devices, identified by
process identification digit "4" in the device marking.
Table 16: AC
the voltage applied to the W/V
ambient temperature, T
the cumulated time during which W/V
(1)
instruction whenever a voltage equal to V
SE
or t
BE
characteristics).
).
CC
must be within the normal operating range):
A
must be 25°C ±10°C,
PP
pin must be equal to V
PP
is at V
PPH
PPH
PP
is applied to the W/V
should be less than 80 hours
).
PPH
(see
W
Page Program (PP)
, t
Table
PP
, t
PP
SE
10)
, or t
pin.
BE
). The
13/55

Related parts for M25P64-VMF6P