CY7C1480V33-167BZI Cypress Semiconductor Corp, CY7C1480V33-167BZI Datasheet - Page 14

IC SRAM 72MBIT 167MHZ 165LFBGA

CY7C1480V33-167BZI

Manufacturer Part Number
CY7C1480V33-167BZI
Description
IC SRAM 72MBIT 167MHZ 165LFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1480V33-167BZI

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1480V33-167BZI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document #: 38-05283 Rev. *G
possible to capture all other signals and simply ignore the
value of the CLK captured in the boundary scan register.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the
boundary scan register between the TDI and TDO balls.
Note that since the PRELOAD part of the command is not
implemented, putting the TAP to the Update-DR state while
performing a SAMPLE/PRELOAD instruction will have the
same effect as the Pause-DR command.
TAP Timing
TAP AC Switching Characteristics
Clock
t
t
t
t
Output Times
t
t
Set-up Times
t
t
t
Hold Times
t
t
t
Notes:
Parameter
TCYC
TF
TH
TL
TDOV
TDOX
TMSS
TDIS
CS
TMSH
TDIH
CH
8. t
9. Test conditions are specified using the load in TAP AC Test Conditions. t
CS
and t
CH
refer to the set-up and hold time requirements of latching data from the boundary scan register.
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH time
TCK Clock LOW time
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
TMS Set-up to TCK Clock Rise
TDI Set-up to TCK Clock Rise
Capture Set-up to TCK Rise
TMS Hold after TCK Clock Rise
TDI Hold after Clock Rise
Capture Hold after Clock Rise
Test Mode Select
Test Data-Out
Test Data-In
Test Clock
(TDO)
(TMS)
(TCK)
(TDI)
1
Description
Over the Operating Range
t TMSS
t TDIS
2
t TMSH
t TDIH
t TH
DON’T CARE
R
/t
t
F
TL
= 1 ns.
3
BYPASS
When the BYPASS instruction is loaded in the instruction
register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO balls. The
advantage of the BYPASS instruction is that it shortens the
boundary scan path when multiple devices are connected
together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
t CYC
[8, 9]
UNDEFINED
4
t TDOX
t TDOV
5
Min.
50
20
20
0
5
5
5
5
5
5
CY7C1480V33
CY7C1482V33
CY7C1486V33
6
Max.
20
10
Page 14 of 31
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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